S9S08DZ60F2MLF Freescale Semiconductor, S9S08DZ60F2MLF Datasheet - Page 371
S9S08DZ60F2MLF
Manufacturer Part Number
S9S08DZ60F2MLF
Description
8-bit Microcontrollers - MCU M74K MASK ONLY-AUTO
Manufacturer
Freescale Semiconductor
Datasheet
1.S9S08DZ60F2MLH.pdf
(416 pages)
Specifications of S9S08DZ60F2MLF
Rohs
yes
Core
HCS08
Data Bus Width
8 bit
Maximum Clock Frequency
40 MHz
Program Memory Size
60 KB
Data Ram Size
4 K
On-chip Adc
Yes
Operating Supply Voltage
2.7 V to 5.5 V
Operating Temperature Range
- 40 C to + 125 C
Package / Case
LQFP-48
Mounting Style
SMD/SMT
Processor Series
MC9S08DZ60
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The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
1
2
I/O
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
is neglected) is:
T
θ
P
P
P
C
D
T
D
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
Operating temperature range (packaged)
Maximum Junction Temperature
Thermal resistance
= Power dissipation on input and output pins — user determined
int
DD
+ P
Single-layer board
Four-Layer board
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
K = P
2
int
Rating
and can be neglected. An approximate relationship between P
MC9S08DZ60 Series Data Sheet, Rev. 4
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
1
) in °C can be obtained from:
64-pin LQFP
48-pin LQFP
32-pin LQFP
64-pin LQFP
48-pin LQFP
32-pin LQFP
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
)
Symbol
× (P
θ
θ
θ
θ
θ
θ
T
T
JA
JA
JA
JA
JA
JA
A
J
D
)
2
–40 to 125
–40 to 105
–40 to 85
Value
135
Appendix A Electrical Characteristics
69
75
80
51
51
52
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Temp.
Code
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
—
M
C
V
and T
371
J
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