MT48LC32M16A2P-75:C TR Micron Technology Inc, MT48LC32M16A2P-75:C TR Datasheet - Page 36

IC SDRAM 512MBIT 133MHZ 54TSOP

MT48LC32M16A2P-75:C TR

Manufacturer Part Number
MT48LC32M16A2P-75:C TR
Description
IC SDRAM 512MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC32M16A2P-75:C TR

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
512M (32Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
115mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1078-2
Figure 29:
WRITE with Auto Precharge
Figure 30:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
READ with Auto Precharge Interrupted by a WRITE
WRITE with Auto Precharge Interrupted by a READ
Internal
States
Internal
States
Notes:
Note:
COMMAND
COMMAND
ADDRESS
ADDRESS
BANK m
BANK m
BANK n
BANK n
1. DQM is HIGH at T2 to prevent D
• Interrupted by a READ (with or without auto precharge): A READ to bank m will inter-
• Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will
DQM
CLK
CLK
rupt a WRITE on bank n when registered, with the data-out appearing CL later. The
PRECHARGE to bank n will begin after
to bank m is registered. The last valid WRITE to bank n will be data-in registered one
clock prior to the READ to bank m (see Figure 30).
interrupt a WRITE on bank n when registered. The PRECHARGE to bank n will begin
after
valid data WRITE to bank n will be data registered one clock prior to a WRITE to bank
m (see Figure 31 on page 37).
DQ
DQ
DQM is LOW.
1
Active
Page
t
READ - AP
BANK n,
WR is met, where
Page Active
BANK n
COL a
T0
NOP
T0
READ with Burst of 4
WRITE - AP
BANK n,
Page Active
BANK n
Page Active
COL a
T1
D
T1
NOP
CL = 3 (BANK n)
a
IN
WRITE with Burst of 4
a + 1
T2
T2
D
NOP
NOP
IN
t
WR begins when the WRITE to bank m is registered. The last
36
BANK m,
READ - AP
T3
COL d
T3
BANK m
OUT
D
NOP
OUT
a
Interrupt Burst, Write-Back
t
WR - BANK n
READ with Burst of 4
- a + 1 from contending with D
Micron Technology, Inc., reserves the right to change products or specifications without notice.
BANK m,
WRITE - AP
COL d
T4
BANK m
CL = 3 (BANK m)
T4
D
NOP
d
t
IN
Interrupt Burst, Precharge
WR is met, where
WRITE with Burst of 4
Transitioning Data
Transitioning Data
T5
T5
d + 1
NOP
NOP
D
IN
Precharge
t
RP - BANK n
t
RP - BANK n
512Mb: x4, x8, x16 SDRAM
T6
T6
d + 2
D
NOP
NOP
D
OUT
d
IN
t
WR begins when the READ
©2000 Micron Technology, Inc. All rights reserved.
Don’t Care
Don’t Care
T7
T7
t WR - BANK m
d + 3
D
d + 1
NOP
NOP
D
OUT
IN
t RP - BANK m
IN
Write-Back
- d at T4.
Idle
Operations

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