BR24S64FVT-WE2 Rohm Semiconductor, BR24S64FVT-WE2 Datasheet - Page 37
![IC EEPROM 64KBIT 400KHZ 8TSSOP](/photos/7/22/72213/8-tssop_tssop-b8j_pkg_sml.jpg)
BR24S64FVT-WE2
Manufacturer Part Number
BR24S64FVT-WE2
Description
IC EEPROM 64KBIT 400KHZ 8TSSOP
Manufacturer
Rohm Semiconductor
Datasheet
1.BR24L01AFV-WE2.pdf
(41 pages)
Specifications of BR24S64FVT-WE2
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
64K (8K x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-TSSOP-B
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BR24S64FVT-WE2TR
●Low voltage malfunction prevention function
●Vcc noise countermeasures
●Notes for use
© 2009 ROHM Co., Ltd. All rights reserved.
BR24L□□-W Series,BR24S□□□-W Series
www.rohm.com
LVCC circuit prevents data rewrite action at low power, and prevents wrong write.
At LVCC voltage (Typ. =1.2V) or below, it prevent data rewrite.
○Bypass capacitor
(1) Described numeric values and data are design representative values, and the values are not guaranteed.
(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
(3) Absolute maximum ratings
(4) GND electric potential
(5) Terminal design
(6) Terminal to terminal shortcircuit and wrong packaging
(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is
recommended to attach a by pass capacitor (0.1μF) between IC Vcc and GND. At that moment, attach it as close to IC
as possible.
And, it is also recommended to attach a bypass capacitor between board Vcc and GND.
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin
in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded,
LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of
fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that
conditions exceeding the absolute maximum ratings should not be impressed to LSI.
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of
GND terminal.
In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may
destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND
owing to foreign matter, LSI may be destructed.
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Technical Note
2009.09 - Rev.D