MCIMX6U7CVM08AB Freescale Semiconductor, MCIMX6U7CVM08AB Datasheet - Page 36

• Manufacturer Part Number: MCIMX6U7CVM08AB
• Description: Processors - Application Specialized i.MX6 DualLite
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX6U7CVM08AB

• Rohs: yes
• Core: ARM Cortex A9
• Processor Series: i.MX6
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 800 MHz
• Data Ram Size: 128 KB
• Maximum Operating Temperature: + 105
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-624
• Interface Type: I2C, I2S, UART, USB
• Memory Type: L1/L2 Cache, ROM, SRAM
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2

Electrical Characteristics
power from VDDHIGH_IN when that supply is available and transitions to the back up battery when
VDDHIGH_IN is lost.
In addition, if the clock monitor determines that the OSC32K is not present, then the source of the 32 K
will automatically switch to a crude internal ring oscillator. The frequency range of this block is
approximately 10–45 kHz. It highly depends on the process, voltage, and temperature.
The OSC32k runs from VDD_SNVS_CAP supply, which comes from the
VDDHIGH_IN/VDD_SNVS_IN. The target battery is a ~3 V coin cell. Proper choice of coin cell type is
necessary for chosen VDDHIGH_IN range. Appropriate series resistor (Rs) must be used when connecting
the coin cell. Rs depends on the charge current limit that depends on the chosen coin cell. For example, for
Panasonic ML621:
For a charge voltage of 3.2 V, Rs = (3.2-2.5)/0.6 m = 1.17 k
36
consumption
Bias resistor
•
•
Current
Cload
Fosc
ESR
Average Discharge Voltage is 2.5 V
Maximum Charge Current is 0.6 mA
i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 1
Min
32.768 KHz
Table 22. OSC32K Main Characteristics
14 MΩ
50 kΩ
10 pF
4 μA
Typ
Crystal Properties
100 kΩ
Max
This frequency is nominal and determined mainly by
the crystal selected. 32.0 K would work as well.
The 4 μA is the consumption of the oscillator alone
(OSC32k). Total supply consumption will depend on
what the digital portion of the RTC consumes. The
ring oscillator consumes 1 μA when ring oscillator is
inactive, 20 μA when the ring oscillator is running.
Another 1.5 μA is drawn from vdd_rtc in the
power_detect block. So, the total current is 6.5 μA on
vdd_rtc when the ring oscillator is not running.
This the integrated bias resistor that sets the amplifier
into a high gain state. Any leakage through the ESD
network, external board leakage, or even a scope
probe that is significant relative to this value will
debias the amp. The debiasing will result in low gain,
and will impact the circuit's ability to start up and
maintain oscillations.
Usually crystals can be purchased tuned for different
Cloads. This Cload value is typically 1/2 of the
capacitances realized on the PCB on either side of
the quartz. A higher Cload will decrease oscillation
margin, but increases current oscillating through the
crystal.
Equivalent series resistance of the crystal. Choosing
a crystal with a higher value will decrease the
oscillating margin.
Comments
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