MC10XS3412DHFK Freescale Semiconductor, MC10XS3412DHFK Datasheet - Page 52

• Manufacturer Part Number: MC10XS3412DHFK
• Description: Power Switch ICs - Power Distribution Eswitch Gen3 1012
• Manufacturer: Freescale Semiconductor

Specifications of MC10XS3412DHFK

• Rohs: yes
• Number Of Outputs: 4
• Operating Supply Voltage: 6 V to 20 V
• Supply Current (max): 20 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: PQFN-24
• Minimum Operating Temperature: - 40 C

Device on Thermal Test Board
52
10XS3412
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
Figure 19. Steady State Thermal Resistance in Dependance on Heat Streading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness
0.035 mm
76.2 mm x 114.3 mm board area,
including edge connector for thermal
testing, 74 mm x 74 mm buried
layers area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 26. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the

JA mn
JA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip
m = 1,
46.42
41.60
40.02
38.86
38.04
500
n = 1
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
600
37.03
32.90
31.63
30.68
29.99
m = 2,
53.82
51.27
55.05
49.47
48.63
n = 2
(C/W)