TS52001-MQFNR Triune Systems, TS52001-MQFNR Datasheet - Page 21

• Manufacturer Part Number: TS52001-MQFNR
• Description: Battery Management IC Hi-Eff Li-ON Charger w/MPPT-Lite
• Manufacturer: Triune Systems

Specifications of TS52001-MQFNR

• Rohs: yes
• Battery Type: Li-Ion
• Output Voltage: 0.4 V
• Output Current: 1.5 A
• Operating Supply Voltage: 4 V to 7.2 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Package / Case: QFN-16
• Charge Safety Timers: Yes
• Mounting Style: SMD/SMT
• Product Type: Charge Management
• Factory Pack Quantity: 1000
• Temperature Monitoring: Yes

The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each
application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the
power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures
above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management
implementation in the application.
APPLICATION USING A SINGLE LAYER PCB
Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board
application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method
(solder paste or thermal conductive epoxy).
In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat.
IMPORTANT:
If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power
dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board.
Specifications subject to change
Note: NOT to Scale
WWW.TRIUNESYSTEMS.COM
Package Thermal Pad
Package Outline
- 21 -
Use as much Copper Area
as possible for heat spread
Ground Layer, 1oz Cu
Bottom Layer, 2oz Cu
Signal Layer, 1oz Cu
Single Layer, 2oz Cu
Epoxy Die attach
Mold compound
Solder
Die
5% - 10% Cu coverage
Exposed pad
Copyright © 2011, Triune Systems, LLC
Thermal Vias with Cu plating
20% Cu coverage
90% Cu coverage
TS52001
Version 1.3