TS52001-MQFNR Triune Systems, TS52001-MQFNR Datasheet - Page 20

• Manufacturer Part Number: TS52001-MQFNR
• Description: Battery Management IC Hi-Eff Li-ON Charger w/MPPT-Lite
• Manufacturer: Triune Systems

Specifications of TS52001-MQFNR

• Rohs: yes
• Battery Type: Li-Ion
• Output Voltage: 0.4 V
• Output Current: 1.5 A
• Operating Supply Voltage: 4 V to 7.2 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Package / Case: QFN-16
• Charge Safety Timers: Yes
• Mounting Style: SMD/SMT
• Product Type: Charge Management
• Factory Pack Quantity: 1000
• Temperature Monitoring: Yes

APPLICATION USING A MULTI-LAYER PCB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be
followed when laying out this part on the PCB.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
JEDEC standard FR4 PCB Cross-section:
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,
thickness of copper, etc.
Specifications subject to change
4 Plane
2 Plane
1.5748mm
Multi-Layer Board (Cross-sectional View)
WWW.TRIUNESYSTEMS.COM
Package and PCB Land Configuration
(square)
For a Multi-Layer PCB
Package Solder Pad
Package Solder Pad
Thermal Isolation
Power plane only
Thermal Via
(bottom trace)
- 20 -
Solder Pad (Land Pattern)
Package Outline
Package Thermal Pad
Thermal Via's
Component Traces
1.5038 - 1.5748 mm
1.0142 - 1.0502 mm
0.5246 - 0.5606 mm
0.0 - 0.071 mm Board Base
Component Trace
Ground Plane
Power Plane
(2oz Cu)
(1oz Cu)
(1oz Cu)
& Bottom Pad
Copyright © 2011, Triune Systems, LLC
TS52001
Version 1.3