MR0A08BCSO35R Everspin Technologies, MR0A08BCSO35R Datasheet - Page 16

• Manufacturer Part Number: MR0A08BCSO35R
• Description: NVRAM 3.3V 1Mb (128Kx8) MRAM
• Manufacturer: Everspin Technologies

Specifications of MR0A08BCSO35R

• Rohs: yes
• Data Bus Width: 8 bit
• Memory Size: 128 KB
• Organization: 128 K x 8
• Interface Type: Parallel
• Access Time: 35 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 3 V
• Operating Current: 20 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: SOIC-32
• Maximum Power Dissipation: 0.6 W
• Operating Temperature Range: - 40 C to + 85 C
• Operating Voltage: 3 V to 3.6 V

Everspin Technologies © 2011
6. REVISION HISTORY
Revision
0
1
2
3
4
5
How to Reach Us:
Home Page:
www.everspin.com
E-Mail:
[e-mail]
[e-mail]
[e-mail]
USA/Canada/South and Central America
Everspin Technologies
1347 N. Alma School Road, Suite 220
Chandler, Arizona 85224
+1-877-347-MRAM (6726)
[phone]
Europe, Middle East and Africa
[e-mail]
Japan
[e-mail]
Asia Pacific
[e-mail]
File Name:
MR0A08B_Datasheet_EST183_Rev5.pdf
Date
Sep 12, 2008 Initial Advance Information Release
May 8, 2009
June 18, 2009
Apr 12, 2011
August 15,
2011
Dec 16, 2011
Description of Change
Revised format; Add Table 3.6 Write Timing Cycle 3; Add Figure 3.6 Write Tim-
ing Cycle 3; Add TSOPII Lead Width Info; Changed to Preliminary from Prod-
uct Concept.
Changed from datasheet from Preliminary to Production except where
noted.
Added SOIC package option.
Corrected SOIC Pin 1 to read DC. Updated contact information. Revised
copyright year.
Changed TSOP-II to TSOP2. Changed logo to new EST Logo. Added Industri-
al Temp Grade option in SOIC package, Table 4.1. Deleted Tape & Reel pack
option for all SOIC packaged parts. Figure 2.1 cosmetic update. Figure 5.2
BGA package outline drawing revised for ball size.
Information in this document is provided solely to enable system and software implementers to use
Everspin Technologies products. There are no express or implied licenses granted hereunder to design or
fabricate any integrated circuit or circuits based on the information in this document. Everspin Technolo-
gies reserves the right to make changes without further notice to any products herein. Everspin makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose,
nor does Everspin Technologies assume any liability arising out of the application or use of any product or
circuit, and specifically disclaims any and all liability, including without limitation consequential or inci-
dental damages. “Typical” parameters, which may be provided in Everspin Technologies data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters including “Typicals” must be validated for each customer application by customer’s
technical experts. Everspin Technologies does not convey any license under its patent rights nor the rights
of others. Everspin Technologies products are not designed, intended, or authorized for use as compo-
nents in systems intended for surgical implant into the body, or other applications intended to support
or sustain life, or for any other application in which the failure of the Everspin Technologies product
could create a situation where personal injury or death may occur. Should Buyer purchase or use Everspin
Technologies products for any such unintended or unauthorized application, Buyer shall indemnify and
hold Everspin Technologies and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized use,
even if such claim alleges that Everspin Technologies was negligent regarding the design or manufacture
of the part. Everspin™ and the Everspin logo are trademarks of Everspin Technologies, Inc. All other
product or service names are the property of their respective owners.
©Everspin Technologies, Inc. 2011
16
MR0A08B Rev. 5, 12/2011
MR0A08B