LCMXO2-4000ZE-1BG332C Lattice, LCMXO2-4000ZE-1BG332C Datasheet - Page 8

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LCMXO2-4000ZE-1BG332C

Manufacturer Part Number
LCMXO2-4000ZE-1BG332C
Description
FPGA - Field Programmable Gate Array 4320 LUTs 275 IO 1.2V 1 Spd
Manufacturer
Lattice
Datasheet

Specifications of LCMXO2-4000ZE-1BG332C

Rohs
yes
Number Of Gates
4 K
Embedded Block Ram - Ebr
92 Kbit
Number Of I/os
275
Maximum Operating Frequency
104 MHz
Operating Supply Voltage
1.14 V to 1.26 V, 1.14 V to 3.465 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
caBGA-332
Distributed Ram
34 Kbit
Minimum Operating Temperature
0 C
Operating Supply Current
124 uA
Factory Pack Quantity
119
User Flash Memory - Ufm
96 Kbit

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LCMXO2-4000ZE-1BG332C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Table 2.2: Standard Qualification Testing
TEST
High Temperature
Operating Life
HTOL
High Temp
Storage Life
HTSL
ESD HBM
ESD MM
ESD CDM
Latch Up
Resistance
LU
Surface Mount
Pre-conditioning
SMPC
Temperature
Cycling
TC
Power
Temperature
Cycling
PTC
Unbiased HAST
UHAST
INDEX Return
STANDARD
Lattice Procedure
# 87-101943,
MIL-STD-883,
Method 1005.8,
JESD22-A108C
MachXO2
Lattice Procedure
# 87-101925,
JESD22-A103C
MachXO2
Lattice Procedure
# 70-100844,
MIL-STD-883, Method
3015.7
JESD22-A114E
JESD22-A115C
Lattice Procedure
# 70-100844,
JESD22-C101D
Lattice Procedure
# 70-101570,
JESD78A
Lattice Procedure
# 70-103467,
IPC/JEDEC
J-STD-020D.1
JESD-A113F
MSL 3
Lattice Procedure
#70-101568,
MIL-STD- 883, Method
1010, Condition B
JESD22-A104C
Lattice Procedure
# 70-104285
JESD22-A118
TEST CONDITIONS
125° C,
Maximum operating Vcc,
168, 500, 1000, 2000
hrs.
150° C, at 168, 500,
1000, 2000 hours.
Human Body Model
Machine Model (MM)
sweep to 200 volts
Charged Device model
Vcc +50% on Power
Supplies. (Max operating
temp.)
10 Temp cycles,
24 hr 125° C Bake
192hr. 30/60 Soak
3 SMT simulation cycles
(1000 cycles)
Repeatedly cycled
between -55° C and
+125° C in an air
environment
(1000 cycles)
Repeatedly cycled
between -55° C and
+125° C in an air
environment with
asynchronous power on-
off cycling.
2 atm. Pressure,
264 hrs, 110 C,
85% Relative Humidity
±100 ma on I/O's,
8
77/lot
2-3 lots
77/lot
2-3 lots
3 parts/lot
1-3 lots typical
3 parts/lot
1-3 lots typical
3 parts/lot
1-2 lots typical
6 parts/lot
1-2 lots typical
All units going
into
Temp Cycling,
UHAST,
BHAST,
45 parts/lot
2-3 lots
45 parts/lot
2-3 lots
45 parts/lot
2-3 lots
SAMPLE SIZE
85/85
(Typical)
Lattice Semiconductor Corporation Doc. #25-106923 Rev. F
PERFORMED ON
Design, Foundry
Process, Package
Qualification
Design, Foundry
Process, Package
Qualification
Design, Foundry
Process
Design, Foundry
Process
Design, Foundry
Process
Design, Foundry
Process
Plastic Packages only
Design, Foundry
Process, Package
Qualification
Design, Foundry
Process, Package
Qualification. This
test is required only for
Automotive-qualified
devices with maximum
rated power > 1 watt or
DTJ > 40ºC.
Foundry Process,
Package Qualification
Plastic Packages only

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