LCMXO2-4000ZE-1BG332C Lattice, LCMXO2-4000ZE-1BG332C Datasheet - Page 29

• Manufacturer Part Number: LCMXO2-4000ZE-1BG332C
• Description: FPGA - Field Programmable Gate Array 4320 LUTs 275 IO 1.2V 1 Spd
• Manufacturer: Lattice

Specifications of LCMXO2-4000ZE-1BG332C

• Rohs: yes
• Number Of Gates: 4 K
• Embedded Block Ram - Ebr: 92 Kbit
• Number Of I/os: 275
• Maximum Operating Frequency: 104 MHz
• Operating Supply Voltage: 1.14 V to 1.26 V, 1.14 V to 3.465 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: caBGA-332
• Distributed Ram: 34 Kbit
• Minimum Operating Temperature: 0 C
• Operating Supply Current: 124 uA
• Factory Pack Quantity: 119
• User Flash Memory - Ufm: 96 Kbit

Package Attributes /
Assembly Sites
Die Family (Product
Line)
Fabrication Process
Technology
Package Assembly
Site
Package Type
Ball/Lead Counts
Die Preparation /
Singulation
Die Attach Material
Mold Compound
Supplier/ID
Wire Bond Material
Wire Bond Methods
Substrate Material or
Lead Frame
Lead Finish Plating or
BGA Ball
Marking
Table 7.1: MachXO2 Package Assembly Data – BGA & TQFP
INDEX Return
7.0 MachXO2 ADDITIONAL FAMILY DATA
Kaohsiung, Taiwan
wafer saw / full cut
Hitachi EN-4900F
Thermosonic Ball
65nm CMOS
EME-G631H
(CS200FL)
Sumitomo
Gold (Au)
LCMXO2
CU C194
Matte Sn
ASEKH
Laser
QFN
32
CEL9750ZHF10ALKU
wafer saw / full cut
Thermosonic Ball
Ablebond 2100A
256/332 & 256
ucBGA, csBGA,
caBGA & ftBGA
HL83X Series
Bismaleimide
65nm CMOS
64, 132, 184,
respectively
(CS200FL)
Gold (Au)
LCMXO2
Malaysia
SAC305
Triazine
Hitachi
ASEM
Laser
29
wafer saw / full cut
Lattice Semiconductor Corporation Doc. #25-106923 Rev. F
Thermosonic Ball
Ablebond 3230
CEL9510HF10
65nm CMOS
(CS200FL)
100 & 144
Gold (Au)
LCMXO2
Matte Sn
Malaysia
Hitachi
ASEM
TQFP
Laser
n/a
wafer saw / full cut
Thermosonic Ball
Ablebond 2100A
9750HF10AKLU
HL83X Series
Bismaleimide
65nm CMOS
(CS200FL)
Gold (Au)
LCMXO2
Malaysia
SAC305
Triazine
fpBGA
Hitachi
ASEM
Laser
484