LBEE5ZSTNC-523 Murata Wireless Solutions, LBEE5ZSTNC-523 Datasheet

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LBEE5ZSTNC-523

Manufacturer Part Number
LBEE5ZSTNC-523
Description
WiFi / 802.11 Modules 802.11b/g/n WiFi BT Type TN Module
Manufacturer
Murata Wireless Solutions
Datasheet

Specifications of LBEE5ZSTNC-523

Rohs
yes
Protocol Supported
802.11 b/g/n, Bluetooth
Frequency Band
2.4 GHz
Data Rate
11 Mbps, 54 Mbps, 65 Mbps
Interface Type
UART
Transmit Power (max)
20 dBm
Antenna Connector Type
U.FL
Operating Supply Voltage
1.8 V, 3.6 V
Supply Current Transmitting
250 mA
Supply Current Receiving
90 mA
Maximum Operating Temperature
+ 70 C
Dimensions
17 mm x 10 mm x 2.2 mm
Minimum Operating Temperature
- 30 C
Modulation Technique
CCK, OFDM

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LBEE5ZSTNC-523
Manufacturer:
NXP
Quantity:
6 000
Preliminary Specification Number: SP-ZSTN-C
P. 1/34
W-LAN + Bluetooth Combo Module Data Sheet
802.11b/g/n and Bluetooth v4.0 module
Product Part Number: LBEE5ZSTNC-523

Related parts for LBEE5ZSTNC-523

LBEE5ZSTNC-523 Summary of contents

Page 1

... W-LAN + Bluetooth Combo Module Data Sheet 802.11b/g/n and Bluetooth v4.0 module Product Part Number: LBEE5ZSTNC-523 Preliminary Specification Number: SP-ZSTN-C P. 1/34 ...

Page 2

Revision Date Code Updated: Module Features for U.FL connector. C Add: Indication for U.FL connector. Updated: Pin description Add: Module Features Oct.21Aug.1 B Update: Notice for Murata Wireless Modules 8.2011 Update: Taping and Reel information Update: Component Height A Jul.15.2011 ...

Page 3

Notice for Murata Wireless Modules. Please read the specification including the NOTICE (Page29) and the Disclaimer (Page33) in this datasheet before using the Murata Wireless Modules. Preliminary Specification Number: SP-ZSTN-C P. 3/34 ...

Page 4

... Module Features  Murata LBEE5ZSTNC module integrates WLAN and Bluetooth functions.  WLAN: IEEE 802. compliant.  Bluetooth: Bluetooth version 4.0 with Bluetooth Low Energy (BLE). Power Class 1.5.  Typical WLAN Transmit Power (typical): +20.0dBm at 11Mbps, CCK (11b) +15.0dBm at 54Mbps, OFDM (11g) +14.5dBm at 65Mbps, OFDM (11n)  ...

Page 5

... Part Number Part Number 3. Block Diagram 2.4GHz (Front End IC) ANT BPF RF Connector (U.FL) Preliminary Specification Number: SP-ZSTN-C : SDIO, : UART, PCM : Texas Instruments WL1271L (PG3.32) : TriQuint TQM679002A (ES2.6) LBEE5ZSTNC-523 Fast CLK (38.4MHz) WL1271 (RF/BB/MAC IC) 1.8V DC-DC Converter P. 5/34 Slow CLK (32.768kHz) SDIO I/F PCM I/F UART VIO VBAT ...

Page 6

Dimensions and Terminal Configurations <Top View> Connector (U.FL) <Side View> T Dimensions Mark Dimensions L 17.0 +/- 0.2 a1 0.6 +/- 0.1 b1 0.3 +/- 0.2 b4 0.3 +/- 0.2 c1 1.0 +/- 0.1 e1 1.0 ...

Page 7

Terminal configuration No. Terminal Name Type 1 GND 2,3 VBAT 4 GND 5 UART_DBG I/O 6 WLAN_EN 7 RS232_RX I/O 8 RS232_TX I/O 9 WLAN_IRQ 10 BT_EN VIO 13 GND 14 SDIO_D2 I/O 15 SDIO_CMD I/O ...

Page 8

UART_RTS I/O 28 UART_CTS I/O 29 UART_TX I/O 30 UART_RX I/O 31 GND - 32 BT_TX_DBG I I/O 35 GND - 36 GND - 37 GND - 38 GND - 39 GND - 40 ...

Page 9

Absolute Maximum Rating Parameter Storage Temperature VBAT Supply Voltage VIO 6. Operating Condition Parameter Operating Temperature VBAT Supply Voltage VIO 7. Input/Output Terminal Characteristic V :High-level input voltage(VDD_IO supply for ring) V :Low-level input voltage IL ...

Page 10

External Slow Clock specification Characteristics(*) Input slow clock frequency Input slow clock accuracy Input transition time Tr/Tf -10% to 90% Frequency input duty cycle Input voltage limits Input impedance Input capacitance Rise and fall time Phase noise Preliminary Specification ...

Page 11

WLAN Power Up/Down Sequence 9.1 Power Up Sequence The following sequence describes device power up from shutdown. Only the WLAN Core is enabled; the BT and FM cores are disabled signals are allowed on the IO pins ...

Page 12

Power Down Sequence 1. DC_REQ of WL1271 will go low only if WLAN is the only core working. otherwise if another core is working (e.g BT) it will stay high WLAN is the only core that is ...

Page 13

BT Power Up/Down Sequence 10.1 Power Up Sequence The following sequence describes device powerup from shutdown. Only the BT core is enabled; the WLAN and FM cores are disabled. Power up requirements signals are allowed on the ...

Page 14

Power Down Sequence The WL1271 indicates completion of BT power up sequence by asserting RTS low. This occurs up to 100ms after BT_EN goes high. Preliminary Specification Number: SP-ZSTN-C P. 14/34 ...

Page 15

HOST Interface 11.1 Host interface Combination WLAN BT SDIO UART 11.2 SDIO Interface 11.2.1 SDIO Clock Switching Characteristics Note: all timing parameter are indicated for the maximum Host interface clock frequency. PARAMETER Fclock Clock frequency,CLK DC Low/High duty cycle ...

Page 16

SDIO Data Switching Characteristics SDIO Interface Read Delay time,assign relative address or data transfer tCR mode tCC Delay time,CMD command invalid to CMD command valid tRC Delay time,CMD response invalid to CMD command valid tAC Access time,CMD command invalid ...

Page 17

UART Interface timing Symbol Characteristics Baud rate t5,t7 Baud rate accuract t3 CTS low to TX_DATA t4 CTS high to TX_DATA t6 CTS-high pulse width t1 RTS low to RX_DATA on t2 RTS high to RX_DATA off Preliminary Specification ...

Page 18

Electrical Characteristics 12.1 DC/RF Characteristics for IEEE802.11b 11Mbps mode unless otherwise specified. 25deg.C, VBAT=3.6V, VDDIO=1.8V Items Specification Mode Frequency Data rate - DC Characteristics - 1. DC current 1) Tx mode at VBAT 2) Rx mode at VBAT 3) ...

Page 19

DC/RF Characteristics for IEEE802.11g 54Mbps mode unless otherwise specified. 25deg.C, VBAT=3.6V, VDDIO=1.8V Items Specification Mode Frequency Data rate - DC Characteristics - 1. DC current 1) Tx mode at VBAT 2) Rx mode at VBAT 3) Sleep mode at ...

Page 20

DC/RF Characteristics for IEEE802.11n-2.4G 65Mbps (MCS7) mode unless otherwise specified. 25deg.C, VBAT=3.6V, VDDIO=1.8V Items Specification Mode Frequency Data rate - DC Characteristics - 1. DC current 1) Tx mode at VBAT 2) Rx mode at VBAT 3) Sleep mode ...

Page 21

DC/RF Characteristics for Bluetooth 25deg.C, VBAT=3.6V, VDDIO=VDDHOST=1.8V Items Bluetooth specification Channel spacing Number of RF channel Power class Operation mode (Rx/Tx) Items 1. DC Current 1) DH1 Packet 50% Rx/Tx slot duty cycle 2) DH3 Packet 50% Rx/Tx slot ...

Page 22

Blocking performance (BER < 0.1%) 13.1 30MHz-2000MHz 13.2 2000MHz-2400MHz 13.3 2500MHz-3000MHz 13.4 3000MHz-12750MHz 14. Intermodulation performance (BER < 0.1%, -64dBm input) 15. Maximum Input Level 16. EDR Sensitivity (at 0.01% BER) 16.1 ...

Page 23

Land pattern 7.2 7.2 8.5 Preliminary Specification Number: SP-ZSTN-C 6.3 5.7 5.3 5.3 4.7 4.3 3.7 3.3 2.7 2.7 2.3 1.7 1.3 0.7 0.3 0.5 1.1 2.1 2.7 3.7 4.3 P. 23/34 Module Outline (unit : mm) ...

Page 24

Reference Circuit Preliminary Specification Number: SP-ZSTN-C P. 24/34 ...

Page 25

... Evaluation board of LBEE5ZSTNC-TEMP Murata LBEE5ZSTNC-TEMP is compatible to the following evaluation board. Please refer to each operation manual if you would like to get more detail on it. COM6M Evaluation board (Compatible to TI Platform) Preliminary Specification Number: SP-ZSTN-C Part Number: LBEE5ZSTNC-TEMP-D P. 25/34 ...

Page 26

Reel Packing (1) Dimensions of Tape (Plastic tape) 1.5+0.1/-0 *1 Cumulative tolerance of max. ± 0.3 every 10 pitches (2) Dimensions of Reel Preliminary Specification Number: SP-ZSTN-C 2.0±0.1 1.5+0.1/-0.0 1 4.0±0.1 * 10.5±0.1 16.0±0.1 feeding direction Label R80 ...

Page 27

Taping Diagrams (4) Leader and Tail tape Tail tape (No components) Components 40 to 200mm Preliminary Specification Number: SP-ZSTN-C [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape ...

Page 28

The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (6) The cover tape and base tape are not adhered at no components area for 250mm min. ...

Page 29

NOTICE 1. Storage Conditions: Please use this product within 6 months after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in ...

Page 30

Soldering Conditions: Carefully perform preheating so that the temperature difference (△T) between the solder and products surface should be in the following range. After mounting, pay special attention to maintain the temperature difference within 100deg.C. Soldering must be carried ...

Page 31

Cleaning: Since this Product is Moisture Sensitive, any cleaning is not permitted. 7. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to ...

Page 32

Limitation of Applications: The product is designed and manufactured for consumer application only and is not available for any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to ...

Page 33

Disclaimer Please read this notice before using the Murata Wireless Modules. 1. Please note that the only warranty that Murata Manufacturing Co., Ltd. (“Murata”) provides regarding the products is its conformance to the specifications provided herein. Accordingly, Murata shall ...

Page 34

Murata’s warranty as provided in Clause 1 above that the products comply with descriptions expressly specified in the specifications shall be effective for a period of six (6) months from the date of delivery. Murata shall not be liable ...

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