LPC1112FHI33/202,5 NXP Semiconductors, LPC1112FHI33/202,5 Datasheet - Page 96

• Manufacturer Part Number: LPC1112FHI33/202,5
• Description: ARM Microcontrollers - MCU CortexM0 32bit 16KB up to 4 kB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHI33/202,5

• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 4 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 490

NXP Semiconductors
Fig 53. Package outline SOT117-1 (DIP28)
LPC111X
Product data sheet
DIP28: plastic dual in-line package; 28 leads (600 mil)
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Note
inches
UNIT
mm
SOT117-1
OUTLINE
VERSION
L
Z
max.
28
5.1
0.2
1
A
pin 1 index
min.
0.51
0.02
A
1
051G05
IEC
max.
0.16
A
4
2
0.066
0.051
1.7
1.3
b
e
D
0.020
0.014
All information provided in this document is subject to legal disclaimers.
MO-015
0.53
0.38
JEDEC
b
1
REFERENCES
Rev. 8 — 20 February 2013
0.013
0.009
0.32
0.23
c
0
b
1.41
1.34
D
36
35
SC-510-28
(1)
JEITA
scale
5
14.1
13.7
0.56
0.54
E
(1)
15
b
14
1
LPC1110/11/12/13/14/15
10 mm
2.54
0.1
e
A
1
w
E
M
A
15.24
2
0.6
32-bit ARM Cortex-M0 microcontroller
e
1
A
0.15
0.13
3.9
3.4
L
PROJECTION
EUROPEAN
15.80
15.24
c
0.62
0.60
M
E
17.15
15.90
0.68
0.63
M
(e )
M
M
H
1
H
E
© NXP B.V. 2013. All rights reserved.
ISSUE DATE
0.25
0.01
99-12-27
03-02-13
w
SOT117-1
max.
0.067
1.7
Z
96 of 114
(1)