LPC1112FHI33/202,5 NXP Semiconductors, LPC1112FHI33/202,5 Datasheet - Page 94

• Manufacturer Part Number: LPC1112FHI33/202,5
• Description: ARM Microcontrollers - MCU CortexM0 32bit 16KB up to 4 kB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHI33/202,5

• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 4 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 490

NXP Semiconductors
Fig 51. Package outline SOT360-1 (TSSOP20)
LPC111X
Product data sheet
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT360-1
max.
1.1
A
0.15
0.05
A
20
1
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
Rev. 8 — 20 February 2013
0
(1)
11
10
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
LPC1110/11/12/13/14/15
A
1
5 mm
L
1
0.75
0.50
32-bit ARM Cortex-M0 microcontroller
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
X
θ
v
0.1
A
© NXP B.V. 2013. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
θ
94 of 114
o
o