LPC1112FHI33/102 NXP Semiconductors, LPC1112FHI33/102 Datasheet - Page 96

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LPC1112FHI33/102

Manufacturer Part Number
LPC1112FHI33/102
Description
ARM Microcontrollers - MCU
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1112FHI33/102

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1112
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
16 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Package / Case
HVQFN-33
Mounting Style
SMD/SMT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1112FHI33/102
Quantity:
10
NXP Semiconductors
Fig 53. Package outline SOT117-1 (DIP28)
LPC111X
Product data sheet
DIP28: plastic dual in-line package; 28 leads (600 mil)
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Note
inches
UNIT
mm
SOT117-1
OUTLINE
VERSION
L
Z
max.
28
5.1
0.2
1
A
pin 1 index
min.
0.51
0.02
A
1
051G05
IEC
max.
0.16
A
4
2
0.066
0.051
1.7
1.3
b
e
D
0.020
0.014
All information provided in this document is subject to legal disclaimers.
MO-015
0.53
0.38
JEDEC
b
1
REFERENCES
Rev. 8 — 20 February 2013
0.013
0.009
0.32
0.23
c
0
b
1.41
1.34
D
36
35
SC-510-28
(1)
JEITA
scale
5
14.1
13.7
0.56
0.54
E
(1)
15
b
14
1
LPC1110/11/12/13/14/15
10 mm
2.54
0.1
e
A
1
w
E
M
A
15.24
2
0.6
32-bit ARM Cortex-M0 microcontroller
e
1
A
0.15
0.13
3.9
3.4
L
PROJECTION
EUROPEAN
15.80
15.24
c
0.62
0.60
M
E
17.15
15.90
0.68
0.63
M
(e )
M
M
H
1
H
E
© NXP B.V. 2013. All rights reserved.
ISSUE DATE
0.25
0.01
99-12-27
03-02-13
w
SOT117-1
max.
0.067
1.7
Z
96 of 114
(1)

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