LPC1112FHI33/102 NXP Semiconductors, LPC1112FHI33/102 Datasheet - Page 95

• Manufacturer Part Number: LPC1112FHI33/102
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHI33/102

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 4 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT

NXP Semiconductors
Fig 52. Package outline SOT361-1 (TSSOP28)
LPC111X
Product data sheet
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT361-1
max.
1.1
A
28
1
Z
y
0.15
0.05
A
1
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
All information provided in this document is subject to legal disclaimers.
JEDEC
0.2
0.1
c
REFERENCES
D
9.8
9.6
Rev. 8 — 20 February 2013
0
(1)
b
p
E
4.5
4.3
(2)
15
14
w
JEITA
scale
0.65
2.5
M
e
H
6.6
6.2
E
LPC1110/11/12/13/14/15
c
5 mm
A
L
1
2
A
1
0.75
0.50
32-bit ARM Cortex-M0 microcontroller
L
p
0.4
0.3
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.2
v
L
L
p
0.13
w
Q
A
(A )
0.1
3
© NXP B.V. 2013. All rights reserved.
y
ISSUE DATE
X
θ
99-12-27
03-02-19
v
Z
0.8
0.5
A
M
(1)
SOT361-1
A
8
0
θ
95 of 114
o
o