MK10DX128VLF5 Freescale Semiconductor, MK10DX128VLF5 Datasheet - Page 2

• Manufacturer Part Number: MK10DX128VLF5
• Description: ARM Microcontrollers - MCU Kinetis 128K Flex
• Manufacturer: Freescale Semiconductor

Specifications of MK10DX128VLF5

• Rohs: yes
• Core: ARM Cortex M4
• Processor Series: K10P32M50SF0
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 128 KB
• Data Ram Size: 16 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: LQFP-48
• Mounting Style: SMD/SMT

1 Ordering parts...........................................................................3
2 Part identification......................................................................3
3 Terminology and guidelines......................................................4
4 Ratings......................................................................................9
5 General.....................................................................................10
2
1.1 Determining valid orderable parts......................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
3.7 Guidelines for ratings and operating requirements............7
3.8 Definition: Typical value.....................................................7
3.9 Typical value conditions....................................................8
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5.1 AC electrical characteristics..............................................10
5.2 Nonswitching electrical specifications...............................10
5.3 Switching specifications.....................................................19
requirements......................................................................6
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
5.3.1
Voltage and current operating requirements.........10
LVD and POR operating requirements.................11
Voltage and current operating behaviors..............12
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
EMC radiated emissions operating behaviors.......18
Designing with radiated emissions in mind...........19
Capacitance attributes..........................................19
Device clock specifications...................................19
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
Table of Contents
6 Peripheral operating requirements and behaviors....................22
7 Dimensions...............................................................................53
8 Pinout........................................................................................53
9 Revision History........................................................................55
5.4 Thermal specifications.......................................................21
6.1 Core modules....................................................................22
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.4 Memories and memory interfaces.....................................30
6.5 Security and integrity modules..........................................35
6.6 Analog...............................................................................35
6.7 Timers................................................................................43
6.8 Communication interfaces.................................................43
6.9 Human-machine interfaces (HMI)......................................51
7.1 Obtaining package dimensions.........................................53
8.1 K10 Signal Multiplexing and Pin Assignments..................53
8.2 K10 Pinouts.......................................................................54
5.3.2
5.4.1
5.4.2
6.1.1
6.3.1
6.3.2
6.3.3
6.4.1
6.4.2
6.6.1
6.6.2
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.9.1
General switching specifications...........................20
Thermal operating requirements...........................21
Thermal attributes.................................................21
JTAG electricals....................................................22
MCG specifications...............................................25
Oscillator electrical specifications.........................27
32 kHz Oscillator Electrical Characteristics...........29
Flash electrical specifications................................30
EzPort Switching Specifications............................34
ADC electrical specifications.................................35
CMP and 6-bit DAC electrical specifications.........40
DSPI switching specifications (limited voltage
range)....................................................................43
DSPI switching specifications (full voltage range).45
I2C switching specifications..................................47
UART switching specifications..............................47
I2S/SAI Switching Specifications..........................47
TSI electrical specifications...................................51
Freescale Semiconductor, Inc.