SIM3U136-B-GM Silicon Labs, SIM3U136-B-GM Datasheet - Page 75
SIM3U136-B-GM
Manufacturer Part Number
SIM3U136-B-GM
Description
ARM Microcontrollers - MCU ARM Cortex-M3 USB 32KB QFN64
Manufacturer
Silicon Labs
Datasheet
1.SIM3U146-B-GM.pdf
(94 pages)
Specifications of SIM3U136-B-GM
Rohs
yes
Core
ARM Cortex M3
Processor Series
SIM3U1xx
Data Bus Width
32 bit
Maximum Clock Frequency
80 MHz
Program Memory Size
32 KB
Data Ram Size
32 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
QFN-64
Mounting Style
SMD/SMT
Interface Type
2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART
Number Of Programmable I/os
65
Number Of Timers
2 x 32 bit
Supply Voltage - Max
3.6 V
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6.4.1. LGA-92 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 µm minimum, all the way around the pad.
6.4.2. LGA-92 Stencil Design
6.4.3. LGA-92 Card Assembly
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
4. A 2 x 2 array of 1.25 mm square openings on 1.60 mm pitch should be used for the center ground pad.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
good solder paste release.
Components.
Rev. 1.0
SiM3U1xx
75
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