IS42S16400F-5BLI ISSI, IS42S16400F-5BLI Datasheet - Page 14
![no-image](/images/no-image-200.jpg)
IS42S16400F-5BLI
Manufacturer Part Number
IS42S16400F-5BLI
Description
DRAM 64M (4Mx16) 200MHz Industrial Temp
Manufacturer
ISSI
Datasheet
1.IS45S16400F-5BLA1.pdf
(59 pages)
Specifications of IS42S16400F-5BLI
Product Category
DRAM
Rohs
yes
Data Bus Width
16 bit
Package / Case
TFBGA-54
Memory Size
64 Mbit
Maximum Clock Frequency
200 MHz
Access Time
6 ns, 5 ns
Supply Voltage - Max
3.6 V
Supply Voltage - Min
3 V
Maximum Operating Current
150 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Factory Pack Quantity
286
IS42S16400F
IS45S16400F
DC ELECTRICAL CHARACTERISTICS
i
i
V
V
i
i
I
I
i
i
I
i
i
i
Notes:
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time in-
2. Icc
3. Input signal chnage once per 30ns.
14
Symbol Parameter
i
i
il
ol
cc1
cc2p
cc2ps
cc2N
cc2Ns
cc3p
cc3ps
cc3N
cc3Ns
cc4
cc5
cc6
oh
ol
creases. Also note that a bypass capacitor of at least 0.01 µF should be inserted between V
to suppress power supply voltage noise (voltage drops) due to these transient currents.
(3)
(3)
1
and Icc
Input Leakage Current
Output Leakage Current
Output High Voltage Level
Output Low Voltage Level
Operating Current
Precharge Standby Current
(In Power-Down Mode)
Precharge Standby Current
(In Non Power-Down Mode)
Active Standby Current
(In Power-Down Mode)
Active Standby Current
(In Non Power-Down Mode)
Operating Current
(In Burst Mode)
Auto-Refresh Current
Self-Refresh Current
4
depend on the output load. The maximum values for Icc
(1)
(1,2)
Test Condition
0V ≤ V
the tested pin at 0V
Output is disabled, 0V ≤ V
i
i
One Bank Operation,
Burst Length=1
t
I
CKE ≤ V
CKE ≥ V
CKE ≤ V
CKE ≥ V
t
I
BL = 4; 4 banks activated
t
t
CKE ≤ 0.2V
out
out
rc
out
ck
out
rc
clk
≥ t
= t
= t
= t
= –2 mA
= +2 mA
= 0mA
= 0mA
rc
ck
rc
iN
clk
≤ V
(
(min.)
il
ih
il
ih
(
miN
(
(
miN
(
(
(
max
miN
miN
miN
max
dd
(Recommended Operation Conditions unless otherwise noted.)
)
) CAS latency = 3
)
, with pins other than
)
)
)
)
out
CAS latency = 3 Com.
t
t
t
t
t
t
t
t
CAS latency = 3
ck
ck
ck
ck
ck
ck
ck
ck
≤ V
= 15ns
= 15ns
= 15ns
= 15ns
1
= ∞
= ∞
= ∞
= ∞
and Icc
Integrated Silicon Solution, Inc. — www.issi.com
dd
4
are obtained with the output open state.
A1, A2, Ind.
A1, A2, Ind.
A1, A2, Ind.
A1, A2, Ind.
A1, A2, Ind.
A1, A2, Ind.
A1, A2, Ind.
A1, A2, Ind.
A1, A2, Ind.
A1, Ind.
A1, Ind.
A1, Ind.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Speed
dd
-5/-6
-5/-6
-5/-6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
-5
-6
-7
-7
-5
-6
-7
-7
-5
-6
-7
-7
and GND for each memory chip
Min.
2.4
–5
–5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max.
110
155
145
140
130
100
140
110
160
150
130
170
150
0.4
95
85
20
15
15
30
25
25
—
5
5
2
4
2
3
7
7
5
5
2
12/01/2011
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
V
V
Rev. I