SSTU32865ET/G,551 NXP Semiconductors, SSTU32865ET/G,551 Datasheet - Page 29

IC REG BUFFER 28BIT 160-TFBGA

SSTU32865ET/G,551

Manufacturer Part Number
SSTU32865ET/G,551
Description
IC REG BUFFER 28BIT 160-TFBGA
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SSTU32865ET/G,551

Logic Type
1:2 Registered Buffer with Parity
Supply Voltage
1.7 V ~ 1.9 V
Number Of Bits
28
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
160-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935275433551
SSTU32865ET/G-S
SSTU32865ET/G-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SSTU32865ET/G,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
19. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.3
7.3.4
8
9
10
11
11.1
11.2
11.3
12
13
13.1
13.2
13.3
13.4
13.5
14
15
16
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Recommended operating conditions. . . . . . . 15
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 16
Test information . . . . . . . . . . . . . . . . . . . . . . . . 18
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 28
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Contact information . . . . . . . . . . . . . . . . . . . . 28
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Functional information . . . . . . . . . . . . . . . . . . . 9
Functional differences to SSTU32864 . . . . . . 10
Chip Select (CS) gating of key inputs
(DCS0, DCS1, CSGATEEN). . . . . . . . . . . . . . 10
Parity error checking and reporting. . . . . . . . . 10
Reset (RESET) . . . . . . . . . . . . . . . . . . . . . . . . 10
Power-up sequence . . . . . . . . . . . . . . . . . . . . 10
Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Output slew rate measurement. . . . . . . . . . . . 20
Error output load circuit and voltage
measurement . . . . . . . . . . . . . . . . . . . . . . . . . 21
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 25
Package related soldering information . . . . . . 25
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in the U.S.A.
1.8 V DDR registered buffer with parity
SSTU32865
Date of release: 28 September 2004
Document number: 9397 750 13799

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