AT45DB021D-SSH-B-RET Atmel, AT45DB021D-SSH-B-RET Datasheet - Page 47

• Manufacturer Part Number: AT45DB021D-SSH-B-RET
• Manufacturer: Atmel

3638J–DFLASH–5/10
23.
Revision History
Doc. Rev.
C
D
G
H
A
B
E
F
J
I
Date
06/2006
02/2007
08/2007
11/2007
02/2008
04/2008
02/2009
03/2009
04/2009
05/2010
Comments
Initial release.
Removed RDY/BUSY pin references.
Changed t
Changed I
Added Chip Erase time
Changed t
Fixed the typographical error in the Block Architecture diagram
Changed the t
Changed part number ordering code to reflect NiPdAu lead finish
Added lead finish details to Ordering Information table
Added Ordering Code Detail
Fixed the typographical error, under Status Register Read, to indicate that bit 3 is a “0”
Replaced 8M1-A MLF Package with 8MA1 UDFN Package
Added part number ordering code details for suffixes SL954/955
Changed t
Changed Deep Power-Down Current values
Updated Absolute Maximum Ratings
Updated System Specifications
Updated template
Changed number of bytes and sectors in
Changed T
Changed BA0 to PA0 and x to P under PA3, row 50h in
Changed A11 from x to P, row 50h in
Changed from 10,000 to 20,000 cumulative page erase/program operations in
Added “Please contact Atmel for availability of devices that are specified to exceed the 20K cycle
cumulative limit” in
- Changed AT45DB021D-MU to AT45DB021D-MH
- Changed AT45DB021D-SSU to AT45DB021D-SSH
- Changed AT45DB021D-SU to AT45DB021D-SH
- Increased typical value from 5µA to 15µA
- Increased maximum value from 15µA to 25µA
- Typ from 0.8 to 400, Max from 2.5 to 700 and Units from s to ms
VCSL
DP
RDPD
DIS
SE
(Max) to 15µA
(Typ and Max) to 27ns and 35ns, respectively
values in
XFR
time to 1ms
time to 35µs
and t
Section 9.3
COMP
Table 16-3 on page 31
times from 400µs to 200µs
Table 13-6 on page 26
Section 7.1.2 on page 13
Table 13-7 on page 27
Atmel AT45DB021D
Section 9.3
47