UBA2211AP PHILIPS [NXP Semiconductors], UBA2211AP Datasheet - Page 15

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UBA2211AP

Manufacturer Part Number
UBA2211AP
Description
Half-bridge power IC family for CFL lamps
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
NXP Semiconductors
12. Package outline
Fig 9.
UBA2211
Product data sheet
DIP8: plastic dual in-line package; 8 leads (300 mil)
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
Package outline SOT97-1 (DIP8)
OUTLINE
VERSION
SOT97-1
max.
0.17
4.2
A
min.
0.02
0.51
A
1
L
050G01
max.
0.13
3.2
A
IEC
Z
2
8
1
pin 1 index
0.068
0.045
1.73
1.14
b
b
D
e
0.021
0.015
0.53
0.38
b
1
All information provided in this document is subject to legal disclaimers.
MO-001
JEDEC
0.042
0.035
1.07
0.89
4
5
b
b
REFERENCES
1
2
0
Rev. 3 — 26 August 2011
A
b
0.014
0.009
1
0.36
0.23
2
w
c
A
E
M
2
SC-504-8
JEITA
scale
D
0.39
0.36
A
9.8
9.2
5
(1)
6.48
6.20
0.26
0.24
E
(1)
10 mm
2.54
Half-bridge power IC family for CFL lamps
0.1
e
7.62
0.3
e
c
1
3.60
3.05
0.14
0.12
(e )
M
L
M
PROJECTION
H
EUROPEAN
1
E
8.25
7.80
0.32
0.31
M
E
10.0
0.39
0.33
M
8.3
UBA2211
H
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
0.254
0.01
99-12-27
03-02-13
w
SOT97-1
0.045
max.
1.15
Z
(1)
15 of 20

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