BF862_00 NXP [NXP Semiconductors], BF862_00 Datasheet - Page 3

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BF862_00

Manufacturer Part Number
BF862_00
Description
N-channel junction FET
Manufacturer
NXP [NXP Semiconductors]
Datasheet
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Main heat transfer is via the gate lead.
THERMAL CHARACTERISTICS
Note
1. Soldering point of the gate lead.
2000 Jan 05
handbook, halfpage
V
V
V
I
I
P
T
T
R
DS
G
stg
j
DS
DG
GS
tot
th j-s
N-channel junction FET
SYMBOL
SYMBOL
(mW)
P tot
400
300
200
100
0
0
Fig.2 Power derating curve.
drain-source voltage
drain-gate voltage
gate-source voltage
drain-source current
forward gate current
total power dissipation
storage temperature
junction temperature
thermal resistance from junction to soldering
point
40
80
PARAMETER
PARAMETER
120
T s ( C)
MCD808
160
3
T
note 1
s
CONDITIONS
90 C; note 1
CONDITIONS
MIN.
65
VALUE
Product specification
200
20
20
40
10
300
+150
150
MAX.
20
BF862
UNIT
K/W
V
V
V
mA
mA
mW
UNIT
C
C

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