EMIF06-MSDN16 STMICROELECTRONICS [STMicroelectronics], EMIF06-MSDN16 Datasheet - Page 7

• Manufacturer Part Number: EMIF06-MSDN16
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

EMIF06-MSD02N16
4
Package information
●
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3.
Figure 13. Micro QFN 3.5x1.2 16L
1.6
Index area
E
k
Pin 1
E2
Epoxy meets UL94, V0
0.70
1
b
Micro QFN 3.5x1.2 16L dimensions
footprint (dimensions in mm)
0.40
D
D2
e
3.00
2.30
b1
M
1
0.20
L1
L
0.45
A
0.30
A1
Figure 14. Marking
Ref.
D2
A1
E2
b1
L1
M
D
A
E
b
e
k
L
Min.
0.45
0.00
0.15
0.25
3.45
2.70
1.15
0.25
0.20
Dot : Pin 1 Identification
N6 = Marking
Millimeters
Typ.
0.50
0.20
0.30
3.50
2.80
1.20
0.30
0.40
0.20
0.25
0.15
0.20
Dimensions
Max.
0.55 0.018 0.020 0.022
0.05 0.000
0.25 0.006 0.008 0.010
0.35 0.010 0.012 0.014
3.55 0.136 0.138 0.140
2.90 0.106 0.110 0.114
1.25 0.045 0.047 0.049
0.40 0.010 0.012 0.016
0.30 0.008 0.010 0.012
Package information
Min.
N6
Inches
0.016
0.008
0.006
0.008
Typ.
®
0.002
Max.
7/12