ESDA14V2-4BFX STMICROELECTRONICS [STMicroelectronics], ESDA14V2-4BFX Datasheet - Page 6

• Manufacturer Part Number: ESDA14V2-4BFX
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

ESDA14V2-4BF2
Figure 16: FLIP-CHIP Tape and Reel Specification
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings relat-
ed to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECO-
PACK specifications are available at: www.st.com.
Table 4: Ordering Information
Note: More informations are available in the application notes:
AN1235: “Flip-Chip: Package description and recommendations for use”
Table 5: Revision History
6/7
ESDA14V2-4BF2
Ordering code
14-Mar-2005
17-Jan-2006
18-Oct-2005
Date
All dimensions in mm
0.73 +/- 0.05
Marking
EA
Revision
Dot identifying Pin A1 location
1
2
3
Package
Flip-Chip
First issue.
Dimension from center bump to corner bump changed in
Figure 13 to indicate diagonal instead of perpendicular
measurement. No values changed. ECOPACK statement
added.
Die dimensions changed in Figure 13. Cavity depth
changed in Figure 16
User direction of unreeling
Weight
2.1 mg
4 +/- 0.1
Description of Changes
4 +/- 0.1
Base qty
5000
Ø 1.5 +/- 0.1
Delivery mode
Tape & reel 7”