ESDA14V2-4BFX STMICROELECTRONICS [STMicroelectronics], ESDA14V2-4BFX Datasheet - Page 5
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ESDA14V2-4BFX
Manufacturer Part Number
ESDA14V2-4BFX
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.ESDA14V2-4BFX.pdf
(7 pages)
Figure 12: Ordering Information Scheme
Figure 13: FLIP-CHIP Package Mechanical Data
Figure 14: Foot print recommendations
340µm min for 315µm copper pad diameter
Solder mask opening recommendation :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Copper pad Diameter :
ESD Array
Breakdown Voltage
14V2 = 14.2 Volts min.
Number of line
4 = 4 lines
Type
B = Bidirectional
Package
F = Flip-Chip
x = 2: Leadfree Pitch = 500µm, Bump = 315µm
1.12 mm ± 50µm
ESDA
Figure 15: Marking
700µm ± 50
315µm ± 50
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
14V2 - 4
650µm ± 65
B
Fx
ESDA14V2-4BF2
x
y
w
x
E
w
z
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