MF1S5009DA4 NXP [NXP Semiconductors], MF1S5009DA4 Datasheet - Page 26

• Manufacturer Part Number: MF1S5009DA4
• Description: Mainstream contactless smart card IC for fast and easy solution development
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
14. Package outline
MF1S5009
Product data sheet
PUBLIC
Fig 20. Package outline SOT500-2
PLLMC: plastic leadless module carrier package; 35 mm wide tape
DIMENSIONS (mm are the original dimensions)
Note
1. Total package thickness, exclusive punching burr.
UNIT
mm
VERSION
OUTLINE
SOT500-2
max.
0.33
A
(1)
35.05
34.95
D
IEC
- - -
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
0
All information provided in this document is subject to legal disclaimers.
JEDEC
- - -
REFERENCES
Rev. 3 — 27 July 2010
189131
scale
JEITA
10
D
- - -
Mainstream contactless smart card IC
A
20 mm
PROJECTION
EUROPEAN
detail X
X
MF1S5009
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
03-09-17
06-05-22
SOT500-2
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