ISL6610 INTERSIL [Intersil Corporation], ISL6610 Datasheet - Page 4

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ISL6610

Manufacturer Part Number
ISL6610
Description
Dual Synchronous Rectified MOSFET Drivers
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet

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Absolute Maximum Ratings
Supply Voltage (PVCC, VCC) . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
BOOT Voltage (V
BOOT To PHASE Voltage (V
PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V (DC)
UGATE Voltage . . . . . . . . . . . . . . . . V
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
HBM ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
+150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Constantly operated at 150°C may shorten the life of the part.
NOTES:
Electrical Specifications
SUPPLY CURRENT
Bias Supply Current
BOOTSTRAP DIODE
Forward Voltage
POWER-ON RESET
POR Rising
POR Falling
Hysteresis
PWM INPUT
Sinking Impedance
Source Impedance
Tri-State Rising Threshold
Tri-State Falling Threshold
Tri-State Shutdown Holdoff Time
SWITCHING TIME (Note 4, See Figure 1)
UGATE Rise Time
LGATE Rise Time
UGATE Fall Time
LGATE Fall Time
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
1. θ
2. θ
3. θ
JA
JA
JC
, “case temperature” location is at the center of the package underside exposed pad. See Tech Brief TB379 for details.
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
GND -8V (<20ns Pulse Width, 10μJ) to 30V (<100ns)
GND - 2.5V (<20ns Pulse Width, 5μJ) to VCC + 0.3V
PARAMETER
EN
V
BOOT-GND
PHASE
, V
PWM
- 5V (<20ns Pulse Width, 10μJ) to V
) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
). . . -0.3V to 25V (DC) or 36V (<200ns)
BOOT-PHASE
4
These specifications apply for T
PHASE
) . . . . . . -0.3V to 7V (DC)
- 0.3V (DC) to V
R
I
R
VCC+PVCC
-0.3V to 9V (<10ns)
SYMBOL
PWM_SNK
PWM_SRC
t
TSSHD
t
t
PDLU
PDLL
t
t
t
t
RU
V
RL
FU
FL
F
ISL6610, ISL6610A
PWM pin floating, V
F
Forward bias current = 2mA
T
Forward bias current = 2mA
T
V
V
3nF Load
3nF Load
3nF Load
3nF Load
Outputs Unloaded
Outputs Unloaded
BOOT
BOOT
PWM
A
A
VCC
VCC
= 0°C to +70°C
= -40°C to +85°C
A
= V
= V
= 300kHz, V
= -40°C to +85°C, unless otherwise noted
PVCC
PVCC
TEST CONDITIONS
= 5V (250mV Hysteresis)
= 5V(300mV Hysteresis)
Thermal Information
Thermal Resistance (Typical)
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
Recommended Operating Conditions
Ambient Temperature Range. . . . . . . . . . . . . . . . . . .-40°C to +85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Notes 2 and 3). . . . . . .
(SOIC - Lead Tips Only)
VCC
VCC
= V
= V
PVCC
PVCC
= 5V
= 5V
0.30
0.30
1.00
3.10
MIN
2.6
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP
0.60
0.60
1.20
3.41
240
400
1.6
3.4
3.0
4.6
4.9
8.0
8.0
8.0
4.0
80
18
25
θ
JA
(°C/W)
90
46
MAX
0.70
0.75
1.40
3.70
4.2
-
-
-
-
-
-
-
-
-
-
-
-
-
November 22, 2006
θ
JC
UNITS
N/A
FN6395.0
(°C/W)
8.5
mA
mV
μA
ns
ns
ns
ns
ns
ns
ns
V
V
V
V
V
V

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