PPC440GR-3PBFFFCX AMCC [Applied Micro Circuits Corporation], PPC440GR-3PBFFFCX Datasheet - Page 62

• Manufacturer Part Number: PPC440GR-3PBFFFCX
• Description: Power PC 440GR Embedded Processor
• Manufacturer: AMCC [Applied Micro Circuits Corporation]

Table 14. Package Thermal Specifications
Thermal resistance values for the E-PBGA package are as follows:
Thermal Management
The following heat sinks were used in the above thermal analysis:
ALPHA W35-15W (35mm x 35mm x15mm)
ALPHA LPD35-15B (35mm x 35mm x15mm)
The heat sinks are manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: [phone]
62
Junction-to-ambient thermal resistance
without heat sink
Junction-to-ambient thermal resistance
with heat sink
Junction-to-case thermal resistance
Junction-to-board thermal resistance
Notes:
Revision 1.16 – July 19, 2006
Preliminary Data Sheet
1. Case temperature, T
2. T
3. T
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3 W/mK.
A
CMax
= T
=
C
- P
T
JMax
Parameter
×θ
CA
- P
, where T
×θ
JC
C
, is measured at top center of case surface with device soldered to circuit board.
, where T
A
is ambient temperature and P is power consumption.
JMax
is maximum junction temperature (+125°C) and P is power consumption.
Symbol
θ
θ
θ
θ
JA
JA
JC
JB
TE-PBGA
TE-PBGA
TE-PBGA
TE-PBGA
Package
E-PBGA
E-PBGA
E-PBGA
E-PBGA
440GR – PPC440GR Embedded Processor
0 (0)
20.0
15.6
15.3
13.9
Resistance Value
ft/min (m/sec)
100 (0.51)
Airflow
18.7
11.9
14.3
13.6
10.4
8.3
6.3
9.3
200 (1.02)
17.9
12.8
10.5
9.0
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
AMCC Proprietary
Notes