MT55L256L36P MICRON [Micron Technology], MT55L256L36P Datasheet - Page 28

• Manufacturer Part Number: MT55L256L36P
• Description: 8Mb ZBT SRAM
• Manufacturer: MICRON [Micron Technology]

8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
15.00 ±0.10
165X Ø 0.45
BALL A11
7.50 ±0.05
7.00 ±0.05
0.85 ±0.075
5.00 ±0.05
13.00 ±0.10
MIN
10.00
6.50 ±0.05
1.00
TYP
165-PIN FBGA
C
1.00
TYP
28
BALL A1
PIN A1 ID
14.00
SEATING PLANE
0.12 C
8Mb: 512K x 18, 256K x 32/36
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
PIPELINED ZBT SRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
©2001, Micron Technology, Inc.