WE128K32N-140G2TC WEDC [White Electronic Designs Corporation], WE128K32N-140G2TC Datasheet - Page 13
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WE128K32N-140G2TC
Manufacturer Part Number
WE128K32N-140G2TC
Description
128Kx32 EEPROM MODULE, SMD 5962-94585
Manufacturer
WEDC [White Electronic Designs Corporation]
Datasheet
1.WE128K32N-140G2TC.pdf
(14 pages)
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
March 2006
Rev. 10
11
1
I/O
I/O
I/O
A
A
A
A
NC
I/O
I/O
I/O
14
16
11
0
8
9
10
0
1
2
12
22
WE
CS
GND
I/O
A
A
A
V
CS
NC
I/O
W E 128K32 X - XXX X X X
10
9
15
CC
2
11
1
3
2
#
#
FIGURE 12 – ALTERNATE PIN CONFIGURATION FOR WE128K32NP-XH1X
#
White Electronic Designs
23
33
I/O
I/O
I/O
I/O
OE#
NC
WE
I/O
I/O
I/O
I/O
Top View
15
14
13
12
7
6
5
4
1
#
I/O
I/O
I/O
I/O
I/O
I/O
A
NC
A
A
A
24
25
26
12
13
16
17
18
7
8
44
34
WE
WE
CS
CS
GND
I/O
I/O
V
CC
A
A
A
4
4
3
3
27
19
#
#
#
#
4
5
5
45
55
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ORDERING INFORMATION
A
A
A
31
30
29
28
23
22
21
20
1
2
3
56
66
LEAD FINISH:
DEVICE GRADE:
PACKAGE TYPE:
ACCESS TIME (ns)
IMPROVEMENT MARK
ORGANIZATION 128K x 32
EEPROM
WHITE ELECTRONIC DESIGNS CORP.
Blank = Gold plated leads
A = Solder dip leads
Q = Compliant
M = Military Screened
I = Industrial
C = Commercial
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400*)
G2T = 22.4mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 509)
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade
P = Alternate Pin Confi guration for HIP package
User Confi gurable as 256K x 16 or 512K x 8
A
O E #
0 - 1 6
128K x 8
W E
13
I / O
8
0 - 7
1
# CS
1
#
Block Diagram
I / O
128K x 8
W E
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
8
8 - 1 5
2
# CS
2
#
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
I / O
128K x 8
W E
8
1 6 - 2 3
3
# CS
3
#
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
V
GND
NC
CC
I / O
W E
128K x 8
WE128K32-XXX
8
2 4 - 3 1
Pin Description
4
# CS
4
#
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected