K4H1G0438A SAMSUNG [Samsung semiconductor], K4H1G0438A Datasheet - Page 17

• Manufacturer Part Number: K4H1G0438A
• Description: 1Gb A-die SDRAM Specification
• Manufacturer: SAMSUNG [Samsung semiconductor]

The following specification parameters are required in systems using DDR333, DDR266 & DDR200 devices to ensure proper system
performance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
20.0 System Characteristics for DDR SDRAM
K4H1G0438A
K4H1G0838A
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
Slew Rate Characteristic
Slew Rate Characteristic
Input Slew Rate
Input Slew Rate
Delta Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
AC CHARACTERISTICS
AC CHARACTERISTICS
PARAMETER
+100
∆tDS
+150
∆tDS
+100
∆tIS
+50
+75
+50
0
0
0
Typical Range
Typical Range
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
∆tDH
∆tDH
+150
+100
∆tIH
+75
+50
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
SYMBOL
DCSLEW
MIN
0.67
DDR400
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
1.5
MIN
(V/ns)
(V/ns)
0.5
4.5
4.5
5.0
5.0
DDR400
Notes
Notes
Notes
0.67
MIN
MAX
4.0
k
k
k
i
i
i
j
j
j
DDR333
a,c,d,f,g,h
b,c,d,f,g,h
a,c,d,f,g,h
b,c,d,f,g,h
Notes
Notes
MAX
1.5
MIN
0.5
DDR333
MIN
0.67
MAX
4.0
DDR266
Rev. 1.1 January 2007
MAX
1.5
MIN
0.5
DDR266
MAX
4.0
DDR SDRAM
Notes
e, l
Units
V/ns
Notes
a, l