S72NS-P SPANSION [SPANSION], S72NS-P Datasheet - Page 9

• Manufacturer Part Number: S72NS-P
• Description: MirrorBit Flash Memory and DRAM
• Manufacturer: SPANSION [SPANSION]

5.
Notes:
1. Packing Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading “S” and packing type designator from ordering part number.
3. Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid
S72NS-P_00_01 September 6, 2006
S72NS
combinations and to check on newly released combinations.
Product
Family
S72NS
Ordering Information
256
The order number (Valid Combination) is formed by the following:
P
Code Flash
Density
D a t a
(Mb)
128
256
512
D0
AJ
S h e e t
Technology
Process
B
P
L
( A d v a n c e
G
S72NS-P Based MCPs/PoPs
Density
D0, E0
DRAM
(Mb)
D0
3
Valid Combinations
PACKING TYPE
0 = Tray
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
FLASH and DDR SPEED
G = 66 MHz Flash, 133 MHz DDR DRAM
C = 80 MHz Flash, 133 MHz DDR DRAM
DDR SUPPLIER
G = DRAM Type 1 x16 DDR DRAM
L = DRAM Type 5 x16 DDR DRAM
PACKAGE MODIFIER
G = 133-ball, 11x10mm, FBGA MCP
B = 133-ball, 8x8mm, FBGA MCP
F = 128-ball, 12x12mm, FBGA PoP
PACKAGE AND MATERIAL TYPE
AJ = Thin profile Fine-pitch BGA Pb-free LF35 MCP (0.5 mm pitch)
KJ = Thin profile Fine-pitch BGA Pb-free PoP (0.65 mm pitch)
DDR DRAM AND DATA FLASH DENSITY
D0 = 128 Mb DRAM, No Data Flash
E0 = 256 Mb DRAM, No Data Flash
PROCESS TECHNOLOGY
P = 90 nm, MirrorBit
CODE FLASH DENSITY
512 = 512 Mb
256 = 256 Mb
128 = 128 Mb
PRODUCT FAMILY
S72NS Multi-Chip Product (MCP)
1.8 V Multiplexed, SRW, Burst Mode Flash and DDR DRAM on Split Bus
I n f o r m a t i o n )
Package Type/
AJG, KJF
AJB, KJF
Material
TM
Technology
DDR Vendor
G, L
Flash & DDR
Speed
G, C
G, C
Packing
(Note 1)
0, 2, 3
Type
7