S72NS-P SPANSION [SPANSION], S72NS-P Datasheet - Page 13

• Manufacturer Part Number: S72NS-P
• Description: MirrorBit Flash Memory and DRAM
• Manufacturer: SPANSION [SPANSION]

6.4
S72NS-P_00_01 September 6, 2006
ASF128—128-ball Fine-Pitch Ball Grid Array (FBGA) 12.0 x 12.0 mm
D a t a
PACKAGE
SYMBOL
SE / SD
JEDEC
D x E
MD
ME
Øb
A1
A2
D1
E1
eE
eD
A
D
E
N
R
n
0.95
0.35
0.59
0.40
S h e e t
MIN
M3-M16,N3-N16,P3-P16,
C3-C16,D3-D16,E3-E16,
F3-F16,G3-G16,H3-H16,
J3-J16,K3-K16,L3-L16,
12.00 mm x 12.00 mm
R3-R16,T3-T16
12.00 BSC.
12.00 BSC.
11.05 BSC.
11.05 BSC.
0.325 BSC.
PACKAGE
0.65 BSC.
0.65 BSC
ASF128
NOM
1.05
0.40
0.45
N/A
128
128
18
18
---
2
MAX
1.15
0.45
0.72
0.50
( A d v a n c e
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
MAXIMUM NUMBER OF BALLS
NUMBER OF LAND PERIMETERS
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S72NS-P Based MCPs/PoPs
NOTE
I n f o r m a t i o n )
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION
3.0, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
N IS THE MAXIMUM NUMBER OF BALLS ON THE FBGA PACKAGE.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3581\16-039.24\8.3.6
11