S71WS256PD0HFFLW0 SPANSION [SPANSION], S71WS256PD0HFFLW0 Datasheet - Page 13

• Manufacturer Part Number: S71WS256PD0HFFLW0
• Description: based MCP/POP Products
• Manufacturer: SPANSION [SPANSION]

7.
7.1
S75WS-P_00_02 September 6, 2006
Physical Dimensions
AMB128— 128-ball 12 x 12 mm Package-on-Package
PACKAGE
SYMBOL
CORNER
A A2
SD SE
D a t a
JEDEC
Ø
D x E
PIN A1
MD
ME
A1
A2
D1
E1
eE
eD
A
D
E
n
N
R
b
0.15
(2X)
128X
L3~L16, M3~M16, N3~N16, P3~P16
C
C3~C16, D3~D16, E3~E16, F3~F16
G3~G16, H3~H16, J3~J16, K3~K16
MIN
0.39
0.55
0.45
0.15
0.08
A1
---
S h e e t
12.00 mm x 12.00 mm
6
b
R3~R16, T3~T16
M
M
INDEX MARK
PACKAGE
12.00 BSC
12.00 BSC
11.05 BSC
11.05 BSC
0.325 BSC
0.65 BSC
0.65 BSC
AMB 128
NOM
C A B
C
0.50
N/A
128
128
---
---
---
18
18
2
9
SIDE VIEW
TOP VIEW
( A d v a n c e
MAX
1.15
0.70
0.55
D
---
S75WS-P based MCP/POP Products
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
MAXIMUM NUMBER OF BALLS
NUMBER OF LAND PERIMETERS
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
C
0.15
A
(2X)
I n f o r m a t i o n )
E
B
C
0.20
0.10
eE
C
C
eD
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
18
17
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION
3.0, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
16
15 14
BOTTOM VIEW
13
12
11
10
D1
9
8
SD
7
6
5
4
7
3 2
1
T
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
U
V
SE
3559 \ 16-038.56 \ 4.28.6
CORNER
PIN A1
7
E1
11