M36P0R9070E0_06 STMICROELECTRONICS [STMicroelectronics], M36P0R9070E0_06 Datasheet - Page 19

• Manufacturer Part Number: M36P0R9070E0_06
• Description: 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M36P0R9070E0
6
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6.
1. Drawing is not to scale.
TFBGA107 8 × 11mm - 9 × 12 active ball array, 0.8mm pitch, package
outline
E
E1
BALL "B1"
FD
A
e
D1
D
b
A1
FE
e
SE
A2
Package mechanical
BGA-Z85
ddd
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