HEDS-9740 HP [Agilent(Hewlett-Packard)], HEDS-9740 Datasheet - Page 5

• Manufacturer Part Number: HEDS-9740
• Description: 180, 300, 360 LPI Small Optical Encoder Modules
• Manufacturer: HP [Agilent(Hewlett-Packard)]

5
Recommended Wave Solder
Conditions
Flux – RMA Water Soluble (per
MIL-F-14256D)
Process Parameters
1. Flux
2. Pre-heat 60 seconds total
3. Solder Pot Zone
4. Wave Solder 255 C,
5. Hot Water Wash
6. Rinse
7. Dry
Package Dimensions
Mounting Option #50
Note:
If not specified, tolerances are xx. 0.7, xx.x 0.3, xx.xx 0.07 mm.
Nominal preheat temp: 90 C
Min: 85 C
Nominal dip in time:
PCB top side: 140 -160 C
PCB bottom side: 240 - 260 C
1.2 meters/minute line speed
2.5 - 4.5 seconds
Min: 2.5 seconds
Max: 5 seconds
1st: 30 C 45 seconds
2nd: 70 C 90 seconds
1st: 23 C 45 seconds
2nd: 23 C 45 seconds
1st: 80 C 105 seconds
2nd: 95 C 105 seconds
(OPTICAL CENTER)
2x
8.7
5.5 ± 0.4
LEAD THICKNESS = 0.25 mm
LEAD PITCH = 2.54 mm
2.00 ± 0.03
0.14
6.40
Max: 110 C
0.50
3.8
4.2
7.5
10.1
1.4
Ordering Information
HEDS-974
3.9
HEDS-9740
HEDS-9741
Lead Bend
0 – Straight Leads
1 – Bend Leads
R 1.4
R 2.6
5.0
3.90 ± 0.15
4.2
0.8
3.0
Q
2
1
Q
2
1
Option
10.8 ± 0.7
Resolution Options
Q – 180 LPI, linear
2 – 300 LPI, linear
1 – 360 LPI, linear
1.8
50
*
*
*
*
1.70 ± 0.22
51
OPTION CODE
9.8
52
PART #
53
54
Mounting Options
50 – Standard
AGILENT
20.2 ± 0.7
15.0
8.4
55
PIN 1 ID
DATE CODE
C = COUNTRY
7.0
OF ORIGIN
12.6 ± 0.7