EPC110 EPC [Espros Photonics corp], EPC110 Datasheet - Page 24

• Manufacturer Part Number: EPC110
• Description: Fully integrated configurable light barrier driver & receiver
• Manufacturer: EPC [Espros Photonics corp]

Layout Information
CSP-10 Package
Recommendations for reliable soldering of solder balls:
QFN-16 Package
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
•
•
•
0.15
Use a pad layout similar as given in Figure 24. Notice that all tracks should go underneath the solder mask area.
Do not connect any pins direct pin to pin inside of the opening of the solder mask.
In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the
round landing pad with a gold surface finish as a solderable area only.
Figure 23: CSP10: Mechanical dimensions
Bottom View
0.5
∅ 0.12
1.9 +0.0/-0.1
0.5
(all measures in mm,
LED/SCK
NC_GND
NC_GND
EN/SI
Solder balls Sn97.5Ag2.5
File: Unben annt
Part Name
<Partname>
Figure 25: QFN-16: Layout recommendation
Pin 1
12
1
11
)
2
Top View
This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form wit
File:
10
3
Designed
Approved
Scale
Page
24
Part No.
1
<Name>
<Name>
M 1:1
<x000 000>
9
4
<Data>
DIN A4
26.02.2009
<Title>
Figure 24: CSP10: Layout recommendation
NC_GND
GND
PD
NC_GND
Shielding of PD pin
∅ 0.3
Opening in solder mask
Conductor layout
no solder mask inside this area
0.5
0.5
2.5
0.1524
Datasheet epc110 - V2.1
www.espros.ch
epc110