GS815018AB GSI [GSI Technology], GS815018AB Datasheet

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GS815018AB

Manufacturer Part Number
GS815018AB
Description
1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM
Manufacturer
GSI [GSI Technology]
Datasheet
119-Bump BGA
Commercial Temp
Industrial Temp
Features
• Register-Register Late Write mode, Pipelined Read mode
• 2.5 V +200/–200 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• ZQ controlled programmable output drivers
• Dual Cycle Deselect
• Fully coherent read and write pipelines
• Byte write operation (9-bit bytes)
• Differential HSTL clock inputs, K and K
• Asynchronous output enable
• Sleep mode via ZZ
• IEEE 1149.1 JTAG-compliant Serial Boundary Scan
• JEDEC-standard 119-bump BGA package
• Pb-Free 119-bump BGA package available
Family Overview
GS815018/36A are 18,874,368-bit (18Mb) high performance
SRAMs. This family of wide, low voltage HSTL I/O SRAMs
is designed to operate at the speeds needed to implement
economical high performance cache systems.
Rev: 1.05 10/2005
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
18Mb Register-Register Late Write SRAM
Pipeline
1M x 18, 512K x 36
Curr (x18)
Curr (x36)
tKHQV
Cycle
Parameter Synopsis
1/25
-357
600
650
2.8
1.4
Functional Description
Because GS815018/36A are synchronous devices, address data
inputs and read/write control inputs are captured on the rising
edge of the input clock. Write cycles are internally self-timed
and initiated by the rising edge of the clock input. This feature
eliminates complex off-chip write pulse generation required by
asynchronous SRAMs and simplifies input signal timing.
GS815018/36A support pipelined reads utilizing a rising-edge-
triggered output register. They also utilize a Dual Cycle
Deselect (DCD) output deselect protocol.
GS815018/36A are implemented with high performance
technology and are packaged in a 119-bump BGA.
Mode Control
There are two mode control select pins (M1 and M2), which
allow the user to set the correct read protocol for the design.
The GS815018/36A support single clock Pipeline mode, which
directly affects the two mode control select pins. In order for
the part to fuction correctly, and as specified, M1 must be tied
to VSS and M2 must be tied to V
at power-up and should not be changed during operation.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High)
of the ZZ signal, or by stopping the clock (CK). Memory data is
retained during Sleep mode.
-333
550
600
3.0
1.5
-300
500
550
3.3
1.6
GS815018/36AB-357/333/300/250
-250
450
500
4.0
2.0
Unit
mA
mA
ns
ns
DD
or V
DDQ
© 2003, GSI Technology
250 MHz–357 MHz
Product Preview
. This must be set
2.5 V V
HSTL I/O
DD

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GS815018AB Summary of contents

Page 1

BGA Commercial Temp 18Mb Register-Register Late Write SRAM Industrial Temp Features • Register-Register Late Write mode, Pipelined Read mode • 2.5 V +200/–200 mV core power supply • 1 1.8 V HSTL Interface • ZQ controlled programmable ...

Page 2

GS815036 Pinout—119-Bump BGA—Top View (Package Rev: 1.05 10/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 1 ...

Page 3

GS815018 Pinout—119-Bump BGA—Top View (Package Rev: 1.05 10/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 1 ...

Page 4

GS815018/36 BGA Pin Description Symbol Type I — ...

Page 5

Write Operations Write operations are initiated when the write enable input signal (SW) and chip select (SS) are captured at logic rising edge of the K clock (and falling edge of the K clock). Late Write In ...

Page 6

Register-Register Late Write, Pipelined Read Truth Table ↑ ↑ ↑ ↑ ...

Page 7

Absolute Maximum Ratings (All voltages reference Symbol V Voltage Voltage in V DDQ V I/O V Voltage on Other Input Pins IN I Input Current on Any Pin IN I Output Current ...

Page 8

Undershoot Measurement and Timing 50% V – 1 20% tKC Rev: 1.05 10/2005 ...

Page 9

Capacitance 1 Parameter Input Capacitance Output Capacitance Output Capacitance (Clock) Note: This parameter is sample tested. AC Test Conditions Parameter Input high level Input ...

Page 10

Input and Output Leakage Characteristics Parameter Input Leakage Current (except mode pins) ZQ, MCH, MCL, EP2, EP3 Pin Input Current Output Leakage Current Operating Currents Parameter Symbol I x36 650 mA DD Operating Current I x18 600 mA DD HSTL ...

Page 11

AC Electrical Characteristics Parameter Clock Cycle Time Clock High Time Clock Low Time Clock High to Output Low-Z Clock High to Output Valid Clock High to Output Invalid Clock High to Output High-Z Address Valid to Clock High Clock High ...

Page 12

G Controlled Read-Write Read A1 Read A2 KHKL KHKL KHKH KHKH KLKH KLKH K tAVKH tKHAX tWVKH tKHWX SW BWx GLQV DQn Note not shown; assumes K tied to V REF Read A1 Read ...

Page 13

Read A1 Read A2 KHKL KHKL KHKH KHKH KLKH KLKH K tAVKH tKHAX tEVKH tKHEX SS tWVKH tKHWX SW SWx ZZ KHQX1 DQn Note not shown; assumes K tied out of phase ...

Page 14

JTAG Port Registers JTAG Pin Descriptions Pin Pin Name I/O Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate TCK Test Clock In from the falling edge of TCK. The TMS ...

Page 15

TDI TMS TCK Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded ...

Page 16

Tap Controller Instruction Set ID Register Contents Die Revision Code Bit # ...

Page 17

Test Logic Reset 1 0 Run Test Idle 0 Instruction Descriptions BYPASS When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when the TAP controller is moved to ...

Page 18

Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output drivers on the ...

Page 19

JTAG Port AC Test Conditions Parameter Input high level Input low level Input slew rate Input reference level Output reference level Notes: 1. Include scope and jig capacitance. 2. Test conditions as shown unless otherwise noted. JTAG TAP Instruction Set ...

Page 20

JTAG Port Recommended Operating Conditions and DC Characteristics Parameter 3.3 V Test Port Input High Voltage 3.3 V Test Port Input Low Voltage 2.5 V Test Port Input High Voltage 2.5 V Test Port Input Low Voltage TMS, TCK and ...

Page 21

TCK TDI TMS TDO Parallel SRAM input JTAG Port AC Electrical Characteristics Parameter Symbol TCK Cycle Time tTKC TCK Low to TDO Valid tTKQ TCK High Pulse Width tTKH TCK Low Pulse Width tTKL TDI & TMS Set Up Time ...

Page 22

Package Dimensions—119-Bump FPBGA (Package B, Variation 2 A1 TOP VIEW SEATING PLANE C Rev: 1.05 10/2005 ...

Page 23

... GS815018AB-333 GS815018AB-300 GS815018AB-250 512K x 36 GS815036AB-357 512K x 36 GS815036AB-333 512K x 36 GS815036AB-300 512K x 36 GS815036AB-250 GS815018AB-357I GS815018AB-333I GS815018AB-300I GS815018AB-250I 512K x 36 GS815036AB-357I 512K x 36 GS815036AB-333I 512K x 36 GS815036AB-300I 512K x 36 GS815036AB-250I GS815018AGB-357 GS815018AGB-333 ...

Page 24

Ordering Information Org Part Number GS815018AGB-300I GS815018AGB-250I 512K x 36 GS815036AGB-357I 512K x 36 GS815036AGB-333I 512K x 36 GS815036AGB-300I 512K x 36 GS815036AGB-250I Notes: 1. Customers requiring delivery in Tape and Reel should add ...

Page 25

Sync SRAM Datasheet Revision History DS/DateRev. Code: Old; Types of Changes New Format or Content 8150xxA_r1 8150xxA_r1; 8150xxA_r1_01 8150xxA_r1_01; 8150xxA_r1_02 8150xxA_r1_02; 8150xxA_r1_03 8150xxA_r1_03; 8150xxA_r1_04 8150xxA_r1_04; 8150xxA_r1_05 Rev: 1.05 10/2005 Specifications cited are subject to change without notice. For latest ...

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