UPG110P NEC, UPG110P Datasheet - Page 7

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UPG110P

Manufacturer Part Number
UPG110P
Description
2 to 8 GHz WIDE BAND AMPLIFIER CHIP
Manufacturer
NEC
Datasheet
QUALITY ASSURANCE
1. 100 % Tests
2. Tests on Sampling Basis
3. Warrantee
4. Caution
1-1 100 % DC Probe
1-2 Visual Inspection
2-1 Bond Pull Tests (In case of recommended chip handling)
2-2 Tests in Standard Package
NEC has a responsibility of quality assurance for the products within 180 days after delivered to customers where these
are handled properly and stored in a desiccater with the flow of dry N
4-1 Take great care to prevent static electricity.
4-2 Be sure that Die Attach is performed in N
MIL-STD-883 Method 2010 Condition B
MIL-STD-883 Method 2011
5 samples/wafer and 20 points tested
Accept 0/Reject 1
Test the electrical characteristics of chips assembled into the standard package used for PG110B
5 samples/wafer tested
DC and RF measurement Accept 1/Reject 2
(Refer to GET-30116)
2
atmosphere.
2
gas.
PG110P
7

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