MSM9000B-xx OKI electronic componets, MSM9000B-xx Datasheet - Page 37

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MSM9000B-xx

Manufacturer Part Number
MSM9000B-xx
Description
DOT MATRIX LCD CONTROLLER
Manufacturer
OKI electronic componets
Datasheet
¡ Semiconductor
PAD CONFIGURATION
Pad Layout
Pad Coordinates
Pad No.
Chip size: 4.76 ¥ 3.29 mm
Bump size: 78 ¥ 100 mm
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
Pad Name
112
88
TEST
SHT
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
V
C/D
WR
V
RD
CS
SO
N1
N2
SI
DD
SS
87
1
X (µm)
–2012
–1837
–1662
–1487
–1312
–1137
–962
–787
–612
–437
–262
1137
1312
–88
262
437
612
787
962
88
Y (µm)
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
Y
Pad No.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Pad Name
COM10
COM11
COM12
COM13
COM14
COM15
COM16
SEG60
SEG59
V
COM9
V
V
V
V
V
V
V
V
V
SS2
CC1
SS6
CC2
SS1
SS4
SS5
SH
C1
C2
24
50
,
3
49
25
X (µm)
1487
1662
1837
2012
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
MSM9000B-xx
X
Y (µm)
–1508
–1508
–1508
–1508
–1375
–1255
–1135
–1015
–895
–775
–605
–495
–385
–275
–165
–55
165
275
385
55
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