D38999/49 Defense Supply Center, D38999/49 Datasheet - Page 9

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D38999/49

Manufacturer Part Number
D38999/49
Description
D38999K / D38999J 500 Cycle Contact
Manufacturer
Defense Supply Center
Datasheet
(see 4.2.2).
assembled, and fully mated connector assembly shall be less than 2.0 when measured in accordance with
4.5.41.
environmentally preferable materials should be used to the maximum extent possible provided that the
material meets or exceeds the operational and maintenance requirements, and promotes economically
advantageous life cycle costs.
.000050 inch (0.00127 mm) in accordance with ASTM-B488 over a suitable underplate. Silver underplate
shall not be used. Wire marks on the back of the contact around the "nonfunctional" outside diameter of the
wire well caused by electrical contact for plating are permissible.
MIL-C-39029.
hardware shall be in accordance with the following designations:
3.3.3 Fungus resistant. Materials used in the construction of these connectors shall be fungus inert.
3.3.4 Magnetic permeability (except finish D of series I and II). The relative permeability of the wired,
3.3.5 Recycled, recovered, or environmentally preferable materials: Recycled, recovered, or
3.3.6 Plating.
3.3.6.1 Contacts (hermetic receptacles). Contacts shall be gold-plated to a minimum thickness of
3.3.6.1.1 Contacts (crimp). The plating and plating thickness on crimp contacts shall be as specified in
3.3.6.2 Shells and accessory hardware. Unless otherwise specified, the finish on shells and accessory
Series I and II: Finishes -
A -
B -
C -
D -
E -
F -
N -
Nickel plate a minimum of .0002 inch (0.005 mm) followed by cadmium plate .0001 inch (0.003
mm) minimum in accordance with QQ-P-416, type II. A preliminary plate of other metal is
permissible. The final finish shall be electrically conductive and shall be silver to light
iridescent yellow in color. Finish A is inactive for new design.
Olive drab cadmium plate in accordance with QQ-P-416 over a suitable underplate. Final
finish shall be electrically conductive.
Hard, anodic, nonconductive in accordance with MIL-A-8625, type III, .0008 inch (0.020 mm)
minimum thickness.
Fused tin plate in accordance with ASTM-B545 or ASTM-B339. The tin shall be reflowed to
promote solderability. Tin application process shall inhibit tin whisker growth.
Electrically conductive, stainless steel, passivated.
Electrically conductive, electroless nickel plating conforming to ASTM B733-90. Use of a
suitable under plate is permissible.
Electrodeposited nickel in accordance with QQ-N-290, class 2, .0001 to .0002 inch (0.003 to
0.005 mm) thickness.
MIL-DTL-38999K
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