MCF5232 ETC, MCF5232 Datasheet - Page 31

• Manufacturer Part Number: MCF5232
• Description: Integrated Microprocessor Hardware Specification
• Manufacturer: ETC

5.2.2
Figure 7
Freescale Semiconductor
15X
e
Y
E
shows MCF5235CVMxxx, MCF5234CVMxxx, and MCF5233CVMxx package dimensions.
S
X
Package Dimensions—256 MAPBGA
0.20
16
15
14
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
13
12
11
VIEW M-M
MCF523x Integrated Microprocessor Hardware Specification, Rev. 1.3
10
D
7
6
5
15X
S
4
3
e
2
1
Figure 7. 256 MAPBGA Package Outline
G
M
A
B
C
D
E
F
H
J
K
L
N
P
R
T
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
K
256X
M
M
0.25
0.10
b
Preliminary
3
M
M
Z
Z
X
Y
A
A2
A1
Z
Mechanicals/Pinouts and Part Numbers
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
4
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DETAIL K
DIM
A1
A2
A
D
E
S
b
e
°
MILLIMETERS
MIN
1.25
0.27
0.40
256X
17.00 BSC
17.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
0.15
MAX
1.60
0.47
0.60
Z
0.30
5
Z
31