AT28HC256E ATMEL Corporation, AT28HC256E Datasheet - Page 14

• Manufacturer Part Number: AT28HC256E
• Description: 256 32K x 8 High Speed Parallel EEPROMs
• Manufacturer: ATMEL Corporation

Packaging Information
14
28D6, 28-Lead, 0.600" Wide, Non-Windowed,
Ceramic Dual Inline Package (Cerdip)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 D-10 CONFIG A
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
.050(1.27) TYP
.032(.813)
.026(.660)
SEATING
PLANE
.045(1.14) X 45°
.225(5.72)
.200(5.08)
.125(3.18)
MAX
.110(2.79)
.090(2.29)
.015(.381)
.008(.203)
.453(11.5)
.447(11.4)
.495(12.6)
.485(12.3)
AT28HC256
1.300(33.02) REF
PIN NO. 1
IDENTIFY
.300(7.62) REF
1.49(37.9)
1.44(36.6)
.620(15.7)
.590(15.0)
.430(10.9)
.390(9.90)
.553(14.0)
.547(13.9)
AT CONTACT
POINTS
.022(.559) X 45° MAX (3X)
.595(15.1)
.585(14.9)
.065(1.65)
.045(1.14)
.025(.635) X 30° - 45°
15
.700(17.8) MAX
0
REF
PIN
1
.023(.584)
.014(.356)
.610(15.5)
.510(13.0)
.021(.533)
.013(.330)
.140(3.56)
.120(3.05)
.015(.381)
.060(1.52)
.098(2.49)
.005(.127)
.012(.305)
.008(.203)
.030(.762)
.015(3.81)
.095(2.41)
.060(1.52)
.530(13.5)
.490(12.4)
MAX
MIN
28F, 28-Lead, Non-Windowed, Ceramic Bottom-
Brazed Flat Package (Flatpack)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 F-12 CONFIG B
32L, 32-Pad, Non-Windowed, Ceramic Leadless
Chip Carrier (LCC)
Dimensions in Inches and (Millimeters)*
MIL-STD-1835 C-12
*Controlling dimension: millimeters
.728(18.5)
.712(18.1)
.006(.152)
.004(.102)
PIN #1 ID
.416(10.6)
.384(9.75)
.286(7.26)
.274(6.96)
.077(1.96)
.043(1.09)
.045(1.14)
.026(.660)
.370(9.40)
.250(6.35)
.015(.381)
.050(1.27) BSC
.045(1.14) MAX
.019(.483)
.119(3.02)
.087(2.21)