ISPLSI5256V-100LB208 LATTICE [Lattice Semiconductor], ISPLSI5256V-100LB208 Datasheet

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ISPLSI5256V-100LB208

Manufacturer Part Number
ISPLSI5256V-100LB208
Description
Manufacturer
LATTICE [Lattice Semiconductor]
Datasheet
• SuperWIDE HIGH-DENSITY IN-SYSTEM
• HIGH PERFORMANCE E
• IN-SYSTEM PROGRAMMABLE
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE AND
• ARCHITECTURE FEATURES
• ispDesignEXPERT™ – LOGIC COMPILER AND COM-
Copyright © 1999 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
5256v_03
Features
PROGRAMMABLE LOGIC
— 3.3V Power Supply
— User Selectable 3.3V/2.5V I/O
— 12000 PLD Gates / 256 Macrocells
— Up to 192 I/O Pins
— 256 Registers
— High-Speed Global Interconnect
— SuperWIDE 32 Generic Logic Block (GLB) Size for
— SuperWIDE Input Gating (68 Inputs) for Fast
— PCB Efficient Ball Grid Array (BGA) Package
— TTL/3.3V/2.5V Compatible Input Thresholds and
— Electrically Erasable and Reprogrammable
— Non-Volatile
— Programmable Speed/Power Logic Path
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Debugging
3.3V IN-SYSTEM PROGRAMMABLE
— Enhanced Pin-Locking Architecture with Single-
— Wrap Around Product Term Sharing Array Supports
— Macrocells Support Concurrent Combinatorial and
— Macrocell Registers Feature Multiple Control
— Four Dedicated Clock Input Pins Plus Macrocell
— Slew and Skew Programmable I/O (SASPI/O™)
— Six Global Output Enable Terms, Two Global OE
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
Market, and Improved Product Quality
Optimum Performance
Counters, State Machines, Address Decoders, etc.
Options
f
t
Output Levels
Optimization
Level Global Routing Pool and SuperWide GLBs
up to 35 Product Terms Per Macrocell
Registered Functions
Options Including Set, Reset and Clock Enable
Product Term Clocks
Supports Programmable Bus Hold, Pull-up, Open
Drain and Slew and Skew Rate Options
Pins and One Product Term OE per Macrocell
max = 125 MHz Maximum Operating Frequency
pd = 7.5 ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
The ispLSI 5000V Family of In-System Programmable
High Density Logic Devices is based on Generic Logic
Blocks (GLBs) of 32 registered macrocells and a single
Global Routing Pool (GRP) structure interconnecting the
GLBs.
Outputs from the GLBs drive the Global Routing Pool
(GRP) between the GLBs. Switching resources are pro-
vided to allow signals in the Global Routing Pool to drive
any or all the GLBs in the device. This mechanism allows
fast, efficient connections across the entire device.
Each GLB contains 32 macrocells and a fully populated,
programmable AND-array with 160 logic product terms
and 5 extra control product terms. The GLB has 68 inputs
from the Global Routing Pool which are available in both
true and complement form for every product term. The
160 product terms are grouped in 32 sets of five and sent
into a Product Term Sharing Array (PTSA) which allows
Functional Block Diagram
ispLSI 5000V Description
— Productivity Enhancing Timing Analyzer, Explore
— PC and UNIX Platforms
Tools, Timing Simulator and ispANALYZER™
3.3V SuperWIDE™ High Density PLD
Logic Block
Logic Block
Generic
Generic
Input Bus
Input Bus
ispLSI
Global Routing Pool
In-System Programmable
(GRP)
Logic Block
Logic Block
Generic
Generic
Input Bus
Input Bus
®
5256V
May 1999
Boundary
Interface
Scan

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ISPLSI5256V-100LB208 Summary of contents

Page 1

Features • SuperWIDE HIGH-DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 3.3V Power Supply — User Selectable 3.3V/2.5V I/O — 12000 PLD Gates / 256 Macrocells — 192 I/O Pins — 256 Registers — High-Speed Global Interconnect — SuperWIDE 32 Generic ...

Page 2

Functional Block Diagram Figure 1. ispLSI 5256V Functional Block Diagram (272 BGA Option) VCCIO 1 I TOE I/O 1 I/O 2 I/O 3 I/O 20 I/O 21 I/O 22 I/O 23 I/O 24 I/O 25 I/O 26 I/O ...

Page 3

Description (Continued) sharing maximum of 35 product terms for a single function. Alternatively, the PTSA can be bypassed for functions of five product terms or less. The five extra product terms are used for shared ...

Page 4

Figure 2. ispLSI 5256V Block Diagram (192 I/O Version I 160 Global 5 160 Routing PT PT Pool 5 160 (GRP I/O CLK2 160 ...

Page 5

Figure 3. ispLSI 5000V Generic Logic Block (GLB) From Global Routing Pool ...

Page 6

Figure 4. ispLSI 5000V Macrocell PTOE GOE0 GOE1 TOE Shared PT Clock 0 Shared PT Clock 1 PT Clock CLK0 CLK1 CLK2 CLK3 PT Reset SET/RESET Shared PT (P)reset 0 PT Preset Shared PT (P)reset 1 Programmable Speed/Power Option Specifications ...

Page 7

Global Clock Distribution The ispLSI 5000V family has four dedicated clock input pins - CLK0 - CLK3. CLK0 input is used as the dedicated master clock that has the lowest internal clock skew with no clock inversion to maintain the ...

Page 8

Figure 6. Boundary Scan Register Circuit for I/O Pins SCANIN BSCAN (from previous Registers cell Shift DR Clock DR Figure 7. Boundary Scan Register Circuit for Input-Only Pins Input Pin SCANIN (from previous cell) Shift DR Clock ...

Page 9

Figure 8. Boundary Scan Waveforms and Timing Specifications TMS TDI T btch TCK TDO Data to be captured Data to be driven out SYMBOL PARAMETER t btcp TCK [BSCAN test] clock pulse width t btch TCK [BSCAN test] pulse width ...

Page 10

Absolute Maximum Ratings Supply Voltage V .................................. -0.5 to +5.4V cc Input Voltage Applied ............................... -0.5 to +5.6V Tri-Stated Output Voltage Applied ........... -0.5 to +5.6V Storage Temperature ................................ -65 to 150 C Case Temp. with Power Applied .............. -55 ...

Page 11

Switching Test Conditions Input Pulse Levels Input Rise and Fall Time Input Timing Reference Levels Ouput Timing Reference Levels Output Load 3-state levels are measured 0.5V from steady-state active level. Output Load Conditions (See figure 8) 3.3V TEST CONDITION R1 ...

Page 12

DC Electrical Characteristics for 2.5V Range SYMBOL PARAMETER V I/O Reference Voltage CCIO V Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL V Output High Voltage OH DC Electrical Characteristics SYMBOL PARAMETER I Input ...

Page 13

External Switching Characteristics ...

Page 14

Internal Timing Parameters PARAM # DESCRIPTION I/O Buffer t idcom 22 Input Pad and Buffer, Combinatorial Input t idreg 23 Input Pad and Buffer, Registered Input t odcom 24 Output Pad and Buffer, Combinatorial Output t odreg 25 Output Pad ...

Page 15

Internal Timing Parameters PARAM # DESCRIPTION GRP t grpi 57 GRP Delay from I/O Pad t grpm 58 GRP Delay from Macrocell Global Control Delays t gclk01 59 Global Clock Delay t gclk23 60 Global Clock 2 ...

Page 16

Power Consumption Power Consumption in the ispLSI 5256V device depends on two primary factors: the speed at which the device is operating and the number of product terms used. The product terms have a fuse-selectable speed/power tradeoff setting. Each group ...

Page 17

Signal Descriptions Signal Name TMS Input - This pin is the Test Mode Select input, which is used to control the JTAG state machine. TCK Input - This pin is the Test Clock input pin used to clock through the ...

Page 18

Signal Locations (208-Pin PQFP) Signal GOE0, GOE1 78, 79 TOE / I/O0 32 GSET/GRST 138 TCK 29 TDI 30 TDO 136 TMS 28 CLK0, CLK1 184,185 CLK2 / I/O89 162 CLK3 / I/O98 173 VCCIO 137 GND 3, 12, 19, ...

Page 19

I/O Locations (208-Pin PQFP) I/O # I/O # Pin Pin ...

Page 20

Signal Locations (208-Ball BGA) Signal GOE0, GOE1 P9, P10 TOE / I/O0 K1 GSET/GRST H14 TCK K2 TDI K3 TDO G14 TMS J1 CLK0, CLK1 A7, B8 CLK2 / I/O89 B13 CLK3 / I/O98 A11 VCCIO H15 GND D10, D12, ...

Page 21

I/O Locations (208-Ball BGA) I/O # I/O # Ball Ball ...

Page 22

Signal Locations (272-Ball Grid Array) Signal GOE0, GOE1 V11, U11 TOE / I SET/RST J18 TCK L4 TDI M1 TDO J20 TMS L3 CLK0, CLK1 C10, D10 CLK2 / I/O 119 A18 CLK3 / I/O 131 B13 VCCIO ...

Page 23

I/O Locations (272-Ball Grid Array) I/O # I/O # Ball Ball ...

Page 24

Pin Configuration ispLSI 5256V 208-pin PQFP I/O 124 1 2 I/O 125 GND 3 I/O 126 4 I/O 127 5 6 I/O 128 VCC 7 I/O 129 8 I/O 130 9 10 I/O 131 I/O 132 11 GND 12 I/O ...

Page 25

Part Number Description ispLSI 5256V Device Family Device Number Speed f 125 = 125 MHz max f 100 = 100 MHz max MHz max Ordering Information ...

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