LPC2292FBD144/01 NXP [NXP Semiconductors], LPC2292FBD144/01 Datasheet - Page 49

• Manufacturer Part Number: LPC2292FBD144/01
• Description: 16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Fig 26. Package outline SOT569-2 (TFBGA144)
LPC2292_2294_7
Product data sheet
TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls
DIMENSIONS (mm are the original dimensions)
mm
UNIT
SOT569-2
VERSION
OUTLINE
max
nom
min
ball A1
index area
ball A1
index area
1.20
1.05
0.95
A
M
K
H
D
B
F
0.40
0.35
0.30
N
G
E
C
A
L
J
A
1
IEC
1
0.80
0.70
0.65
A
2
2
3
0.50
0.45
0.40
4
b
5
e
6
12.1
12.0
11.9
e
D
7
JEDEC
D
1
8
9
12.1
12.0
11.9
REFERENCES
10
E
0
11
Rev. 7 — 4 December 2008
16/32-bit ARM microcontrollers with external memory interface
b
12
0.8
e
13
JEITA
9.6
e
1
scale
B
e
5
w
v
9.6
e
e
A
E
2
M
M
2
C
C
0.15
A
v
B
10 mm
0.05
A
w
A
2
LPC2292/LPC2294
0.1
y
A
1
y
1
0.08
C
y
1
PROJECTION
detail X
EUROPEAN
C
X
y
© NXP B.V. 2008. All rights reserved.
ISSUE DATE
08-01-29
08-03-14
SOT569-2
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