SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 45

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Fig 41. Package outline SOT908-1 (HVSON8)
SE97_5
Product data sheet
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT908-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
X
E
L
h
0.3
0.2
b
IEC
0.2
c
8
1
e
D
3.1
2.9
(1)
D
e
D
1
h
2.25
1.95
b
D h
MO-229
JEDEC
5
E
3.1
2.9
4
(1)
REFERENCES
Rev. 05 — 6 August 2009
1.65
1.35
DDR memory module temp sensor with integrated SPD, 3.3 V
E h
B A
w
v
E
0.5
e
M
M
JEITA
C
C
1.5
e 1
A
B
0.5
0.3
L
A
A
0.1
v
1
y
1
0.05
C
w
0
detail X
0.05
y
scale
PROJECTION
EUROPEAN
1
0.1
y 1
exposed tie bar (4 )
exposed tie bar (4 )
C
y
2 mm
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
c
05-09-26
05-10-05
SOT908-1
SE97
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