BH616UV8010DI70 BSI [Brilliance Semiconductor], BH616UV8010DI70 Datasheet - Page 9
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BH616UV8010DI70
Manufacturer Part Number
BH616UV8010DI70
Description
Ultra Low Power/High Speed CMOS SRAM 512K X 16 bit
Manufacturer
BSI [Brilliance Semiconductor]
Datasheet
1.BH616UV8010DI70.pdf
(11 pages)
n ORDERING INFORMATION
n PACKAGE DIMENSIONS
R0201-BH616UV8010
Note:
Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does
not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result
in significant injury or death, including life-support systems and critical medical instruments.
48 mini-BGA (6 x 8)
VIEW A
BH616UV8010
D1
X
X
Z Y Y
9
NOTES:
8.0
D
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
BALL PITCH e = 0.75
6.0
E
SPEED
55: 55ns
70: 70ns
PKG MATERIAL
-: Normal
G: Green, RoHS Compliant
P: Pb free, RoHS Compliant
GRADE
I: -40
PACKAGE
D: DICE
A: BGA-48-0608
T: TSOP I-48
o
48
N
C ~ +85
BH616UV8010
5.25
D1
o
C
3.75
E1
Revision
May.
2006
1.2