BH616UV1611BI55 BSI [Brilliance Semiconductor], BH616UV1611BI55 Datasheet
BH616UV1611BI55
Related parts for BH616UV1611BI55
BH616UV1611BI55 Summary of contents
Page 1
Ultra Low Power/High Speed CMOS SRAM bit / 2M x 8-bit Pb-Free and Green package materials are compliant to RoHS n FEATURES Ÿ Wide V low operation voltage : 1.65V ~ 3.6V CC Ÿ Ultra low power ...
Page 2
PIN DESCRIPTIONS Name A0 to A19 Address Input (word mode A20 Address Input (byte mode) (TSOP only) CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input WE Write Enable Input OE Output Enable Input LB and ...
Page 3
TRUTH TABLE Byte Mode (TSOP only) MODE CE2 CE1 WE Chip H X De-selected X L (Power Down) Output L H Disabled Read L H (byte mode) Write L H (byte mode) Word Mode MODE CE1 CE2 WE H ...
Page 4
ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER Terminal Voltage with V TERM Respect to GND Temperature Under T BIAS Bias T Storage Temperature STG P Power Dissipation Output Current OUT 1. Stresses greater than those listed under ABSOLUTE ...
Page 5
DATA RETENTION CHARACTERISTICS (T SYMBOL PARAMETER V V for Data Retention Data Retention Current CCDR Chip Deselect to Data t CDR Retention Time t Operation Recovery Time R 1. Typical characteristics are at T =25 A ...
Page 6
BYTE FUNCTION PARAMETER NAME BYTE Setup Time t BS BYTE Recovery Time t BR CE2 CE1 BYTE n AC ELECTRICAL CHARACTERISTICS (T READ CYCLE JEDEC PARANETER PARAMETER NAME NAME t t Read Cycle Time AVAX Address ...
Page 7
SWITCHING WAVEFORMS (READ CYCLE) (1,2,4) READ CYCLE 1 ADDRESS D OUT (1,3,4) READ CYCLE 2 CE1 CE2 D OUT (1, 4) READ CYCLE 3 ADDRESS OE CE1 CE2 LB OUT NOTES high in read ...
Page 8
AC ELECTRICAL CHARACTERISTICS (T WRITE CYCLE JEDEC PARANETER PARAMETER NAME NAME t t Write Cycle Time AVAX Address Set up Time AVWL Address Valid to End of Write AVWH Chip ...
Page 9
WRITE CYCLE 2 ADDRESS CE1 CE2 LB OUT D IN NOTES must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE1 and CE2 ...
Page 10
ORDERING INFORMATION BH616UV1611 Note: Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which ...
Page 11
PACKAGE DIMENSIONS TSOP I-48 Pin (12mm x 20mm) R0201-BH616UV1611 BH616UV1611 11 Revision 1.3 Otc. 2006 ...
Page 12
Revision History Revision No. History 1.0 Initial Production Version 1.1 Change I-grade operation temperature range - from –25 O 1.2 Add Part Number for 70ns 1.3 Add DICE form and 48 TSOP-I package type Change BGA package dimension for ...