VND5050J-E13TR STMICROELECTRONICS [STMicroelectronics], VND5050J-E13TR Datasheet - Page 19

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VND5050J-E13TR

Manufacturer Part Number
VND5050J-E13TR
Description
Double channel high side driver with analog current sense for automotive applications
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
VND5050J-E / VND5050K-E
4
4.1
Package and PCB thermal data
PowerSSO-12 thermal data
Figure 30. PowerSSO-12 PC Board
Figure 31. R
Figure 32. PowerSSO-12 Thermal Impedance Junction Ambient Single Pulse
Pulse Calculation Formula
where δ = t
Z
PCB thickness=1.6mm, Cu thickness=70µm (front and back side), Copper areas: from minimum pad lay-out to 8cm
THδ
Layout condition of R
=
R
TH
P
/T
thj-amb
δ
+
Z
THtp
th
Vs. PCB copper area in open box free air condition
1000
100
and Z
0.1
RTHj_amb(°C/W)
10
0.0001
ZTH (˚C/W)
1
70
65
60
55
50
45
40
(
1 δ
th
0
measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x 86mm,
0.001
)
2
0.01
PCB Cu heatsink area (cm^2)
0.1
4
Time (s)
1
6
10
8
100
Package and PCB thermal data
1000
10
Footprint
2 cm
8 cm
2
2
19/28
2
).

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