L6382D_07 STMICROELECTRONICS [STMicroelectronics], L6382D_07 Datasheet - Page 18

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L6382D_07

Manufacturer Part Number
L6382D_07
Description
Power management unit for microcontrolled ballast
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package mechanical data
8
18/22
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at:
www.st.com
L6382D

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